Thermavant Technologies, LLC

University of Missouri

Raytheon Company

Joseph A Boswell

Hongbin Ma

Peng Cheng

Daniel A Pounds

James E Benedict

Corey A Wilson

Tuan L Duong

Benjamin Alexander

Bruce Drolen

Adam D Leeds

Joshua Schorp

An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more oscillating heat pipes embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.

Thermally-enhanced and deployable structures

A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.

Lightweight structurally and thermally efficient oscillating heat pipe panel

A thermally driven heat pump includes a low temperature evaporator for evaporating cooling fluid to remove heat A first heat exchanger located at an outlet of a converging/diverging chamber of a first ejector receives a flow of primary fluid vapor and cooling fluid vapor ejected from the first ejector for condensing a portion of the cooling fluid vapor An absorber located in the first heat exchanger absorbs cooling fluid vapor into an absorbing fluid to reduce the pressure in the first heat exchanger A second heat exchanger located at an outlet of a converging/diverging chamber of a second ejector receives primary fluid vapor and cooling fluid vapor ejected from the second ejector for condensing the cooling fluid vapor and the primary fluid vapor A separator in communication with the second ejector, the low temperature evaporator and the primary fluid evaporator separates the primary fluid from the cooling fluid.

Thermally driven heat pump for heating and cooling

A hybrid thermoelectric-ejector active cooling system having an increased Coefficient of Performance (COP) when compared to typical thermoelectric cooling modules. A thermoelectric cooling module is integrated with an ejector cooling device so that heat from the thermoelectric cooling module is rejected to a high temperature evaporator of the ejector cooling device. This provides for a total COP greater than the sum of the COPs of the thermoelectric cooling module and ejector cooling device individually. For example, given 1 unit input power into the thermoelectric cooling module, the heat received by the cold side of the thermoelectric cooling module would be COP&#xd7;1; and the energy rejected by the hot side of the thermoelectric cooling module and to drive the ejector cooling device would be COP+1. Thus, the cooling received by the low temperature evaporator of the ejector cooling device is COP&#xd7;(COP+1); and therefore total COPis COP+COP+COP&#xd7;COP. In addition, the hybrid thermoelectric ejector active cooling system will be able to operate at higher temperature differentials than standalone thermoelectric cooling devices.

Hybrid thermoelectric-ejector cooling system

Growing community of inventors

San Francisco, CA, United States of America

Joseph A Boswell