Intel Corporation

Joseph A Benefield

Michael T Crocker

Peter A Davison

David J Llapitan

Ben M Broili

Heat dissipation devices and molding processes for fabricating such devices, which have at least two regions comprising different conductive materials such that efficient thermal contact is made between the different conductive materials. The molding processes include injection molding at least two differing conductive materials.

Injection molded heat dissipation device

Process for forming molded heat dissipation devices

A retention mechanism is formed of a molded plastic member having a base portion with at least one through-hole and a first through-slot adjacent thereto. The plastic member includes a card receiving structure having an open side, and a second receiving structure having an open side with a second through-slot through a wall of the receiving structure perpendicular to the base portion. Inserted in the plastic member is an elongate metal member having a base portion and a distal end. The metal member extends through the first and second through-slots with the base portion positioned adjacent the base portion and the distal portion positioned within the second receiving structure. The distal portion of the metal member is formed to provide spring action against a member inserted into the second receiving structure.

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Olympia, WA, United States of America

Joseph A Benefield