Infineon Technologies Ag

Josef Schwaiger

Michael Melzl

Thilo Stache

Stephan Bradl

Werner Kröninger

Ludwig Schneider

Stephen Bradl

Walther Grommes

Ralf Otremba

Thorsten Meyer

Josef Hoeglauer

Helmut Strack

Xaver Schloegel

Markus Brunnbauer

Werner Kroeninger

Ottmar Geitner

Werner Kroninger

Lukas Ossowski

The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

Treatment of a substrate with a liquid medium

A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.

Method for machining a workpiece on a workpiece support

A semiconductor device having a topology adjustment and a method for adjusting the topology of a semiconductor device. The semiconductor device includes a semiconductor wafer having first and second opposing sides with an active area formed on a first portion of the first side having a topology extending a first distance above the first side. A support member is attached to a second portion of the first side and extending a second distance above the first side, wherein the first distance is about the same as the second distance. In some exemplary embodiments, the support member is formed by applying adhesive to the second portion. The wafer is then spun to adjust the second distance.

Semiconductor device and method

A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated.

Semiconductor module

Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium

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Teugn, Germany

Josef Schwaiger