Hamilton Sundstrand Corporation

Hs Elektronik System Gmbh

Josef Maier

Kai Paintner

John A Dickey

Jeffrey T Wavering

Rainer Seidel

Michael James Krenz

Carl A Wagner

Norbert J Simper

Richard Sinning

Francis C Belisle

Michael J Hanson

Michael William Foster

Mark Hamilton Severson

Eric Alan Carter

Donald G Kilroy

Markus Greither

Bruce D Beneditz

Massoud Vaziri

Bernd Loefflad

Curtis J Plude

Peter Brantl

Nicholas J Robertson

Dennis R Anderson

Michael Beutel

Daniel M Lynch

Ralf Greiner

Bernd Löfflad

Rainer J Seidel

Kyle Steven Ives

Bernd Lofflad

Darren Krakowski

The present invention relates to a power semiconductor chip module, comprising a substrate having a top side and a bottom side; at least one first power semiconductor device attached to the top side of the substrate; at least one first conductive structure thermally and electrically connecting the first power semiconductor device to the top side of the substrate; at least one second power semiconductor device attached to the bottom side of the substrate; and at least one second conductive structure connecting the second power semiconductor device to the bottom side of the substrate.

Power semiconductor chip module

A solid state switch module is provided for use in a power distribution network including an input differential protection connection for receiving a measured current value from an upstream module. The solid state switch module also includes an output differential protection connection for sending a measured current value. The solid state switch module includes a trip outlet for sending a trip signal to an upstream solid state switch, and a trip inlet for receiving a trip signal from a downstream solid state switch. The trip inlet is operably coupled to the switch. A current sensor measures the current value of a connected power transmission line across the solid state switch module. A summer adds a current input from a parallel module with the current measures by the current sensor. A comparator determines whether an amount of current lost between the solid state switch module and an upstream module is acceptable.

Method for improving power distribution protection

A printed wiring board (PWB) includes a substrate having first and second opposing surfaces and a busbar coupled to the substrate. The busbar includes a power input connector and a cross-sectional dimension configured and disposed to carry at least 100 amperes. At least one semiconductor device is mounted to the busbar. The at least one semiconductor device includes an input electrically coupled to the busbar and an output. One or more output conductors are electrically coupled to the output of the at least one semiconductor device. The one or more output conductors include a cross-sectional dimension configured and disposed to carry at least 50 amperes.

Printed wiring board (PWB) for high amperage circuits

An aircraft power distribution architecture includes a power rail extending generally along the length of an aircraft for receiving power from a generator, and for distributing power through plug-in modules located along the length of the power rail.

Power distribution architecture for aircraft

An aircraft power distribution system is disclosed that includes a power distribution box. A generator supplies power to the power distribution box, and a load receives power from the power distribution box. The power distribution box includes a board supporting plug-in pins receiving the power. A contactor is supported by the board to selectively providing power to a secondary power distribution connector supported on the board. The board includes power traces that are run within the board to connect the plug-in pins to the secondary power distribution connector. Protection and secondary power distribution circuitry is also supported by the board and connected to the contactors and/or power traces by control traces. The power and control traces eliminate loose wiring and harnesses.

Modular primary distribution contact board

A method of controlling a solid state power controller includes determining whether a voltage across a switch of the solid state power controller is within a predetermined voltage threshold. If the voltage is outside of the predetermined voltage threshold, the current is limited to a non-zero current. As result of this method a SSPC in Offstate stays off and a SSPC in Onstate stays on during lightning events.

Solid state power controller with lightning protection

A method of controlling a power system provides at least two alternative sources of power delivering power to a power bus. Switches are provided between each of the at least two sources of power and the power bus. The bus is powered by a first of the at least two sources of power. A characteristic of the power supplied by the sources of power is monitored. Switching from the first source of power to a second source of power occurs by opening a switch associated with the first source of power, and closing the switch associated with the second source of power. The timing for performing the switching is selected such that one or more characteristics of the power supplied by the first and second sources of power are close to each other to minimize the apparent break in the power. A power system incorporate controls for effecting the method.

No break power transfer with solid state power controls

An improved EPGS with an integrated electrical system architecture uses SPDAs with localised power converters to provide the necessary types of power to their respective electrical loads so that a single type of primary power bus may be used to connect its PDAs to respective SPDAs.

Electrical power generation system having multiple secondary power distribution assemblies with integral power conversion

A solid state power control scheme is provided with a ground fault interrupt function. Essentially, if a neutral wire is associated with the power supply, the current is sensed in that neutral wire. The sensed neutral wire current is subtracted from a summed current on the power supply lines. If that result is greater than a predetermined limit, then the ground fault function is actuated and the circuit is opened. For power supplies, both those with and without neutral wires, the current is sensed by a shunt resistor on the power supply line.

Ground fault interrupts for solid state power controllers

A circuit board is provided with a plurality of MOSFETs (metal oxide semiconductor field effect transistors) each of which include a field effect transistor and an associated control circuit. The control circuits are mounted in a control section of the board remote from a power section mounting the MOSFETs. The present invention reduces the assembly steps required in the prior art wherein the MOSFET and its control circuit were mounted as preassembled units to the board. Moreover, the number of MOSFETs per unit area of board is increased by the present invention.

Circuit board with high density power semiconductors

A solid state power control module contains non-volatile memory. A switch for opening is provided to break a supply of power to a component. The switch is operable to trip (open) when an undesirable condition is detected, and further to be opened upon receiving a control signal. A status of the switch is stored in the non-volatile memory. A detector is provided for identifying when a module has been mounted in a housing, and communicates with the non-volatile memory if it is determined that the module is newly installed in a housing. A system and method are also claimed.

Solid state power control module with removal detector

An electric power generation and distribution system includes a primary distribution panel, which preferably operates at 230 VAC, and a High Voltage Direct Current (HVDC) panel in direct electrical communication therewith. The HVDC panels power motor controllers which drive electric motors residing in the center or aft sections of the aircraft. As many of the large electrical loads are located in the aft section of the aircraft, an aft electronics bay is located adjacent the aircraft wing roots to house the primary distribution panels and the HVDC panels.

Primary panel and motor controller integration for aircraft power distribution system

A circuit carrier assembly includes a plurality of substrates directly secured together by an electrically conductive securing substance. In one example, the securing substance is a conductive epoxy. In another example, the electrically conductive securing substance is solder. Still another example includes a combination of solder and conductive epoxy. A non-conductive epoxy provides further mechanical connection and thermal conductivity between the substrates while also electrically isolating selected portions of the substrates in one example. The electrically conductive securing substance not only mechanically secures the substrates together and provides thermal conductivity between the substrates, which increases the thermal capacitance of the assembly, but also establishes at least one electrically conductive path between the substrates.

Compact circuit carrier package

A method of controlling a solid state power controller includes selectively allowing a transient current through a solid state power control switch in response to the transient current exceeding at least one threshold.

Growing community of inventors

Munningen, Germany

Josef Maier