Infineon Technologies Ag

Siemens Aktiengesellschaft

Josef Heitzer

Peter Stampka

Michael Huber

Frank Pueschner

Detlef Houdeau

J&uuml;rgen Fischer

Bernd Barchmann

Erik Heinemann

Josef Mundigl

Josef Kirschbauer

Jurgen Fischer

Frank P&uuml;schner

Helmut Graf

A device having a semiconductor component and a printed circuit board are described. The semiconductor component has external contacts and the printed circuit board has contact terminals. The contact terminals display a central blind opening, into which the external contacts of the semiconductor component protrude and are in a force-locking engagement with the contact terminal areas. In the method of electromechanically connecting the two parts to form a device, after they have been aligned, the two components are merely pressed onto each other.

Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two

A carrier element for a semiconductor chip and in particular for incorporation into smart cards. The carrier element has an encapsulation composition protecting the semiconductor chip. The carrier element connections are disposed on one of the main surfaces of the encapsulation composition along only two opposite edges. They are made of a conductive material and have a reduced thickness at the ends facing one another, the cross section having a step only on one side. The semiconductor chip is disposed on the connections in a region of the section of reduced thickness and is mechanically connected to the connections.

Carrier element for a semiconductor chip for incorporation into smart cards

A chip module has a contact area disposed on its outer side formed of a plurality of essentially flat contact elements of electrically conductive material insulated from one another. At least one semiconductor chip having one or more integrated semiconductor circuits that are electrically connected to the contact elements of the contact area via bonding wires. The contact elements of the chip module are formed by a prefabricated lead frame for supporting the at least one semiconductor chip and have on two opposing sides of the chip module outwardly offset terminals arranged in rows next to one another. The outwardly offset terminals are provided for surface mounting the chip module on the mounting surface of an external printed circuit board or an external circuit board substrate.

Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate

The chip module is particularly suitable for implanting in a smart card body. The module has a carrier and a chip fitted on the carrier. A pedestal or base-type elevation formed on the carrier laterally surrounds the chip completely or partly.

Chip module, in particular for implantation in a smart card body

A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.

Smart card module and smart card including a smart card module

A microprocessor has a control unit with a housing surrounding the control unit. The invention also relates to a chip card having such a microprocessor that is protected against manipulations. At least one sensor indicates ambient states and is connected to the control unit and is provided in a region of the housing of the microprocessor. The control unit is configured in such a way that it can be placed in an inactive state if a measurement signal that indicates a predetermined ambient state is and/or is not fed to the control unit from the sensor.

Microprocessor, in particular for use in a chip card, with a control unit and with a housing surrounding the control unit

A carrier element for a semiconductor chip, in particular to be built into smart cards. The carrier element has a substrate that carries the chip and a stiffening sheet which also carries the chip and has a recess for receiving the chip and its connection leads therein. An edge of the recess is provided with a frame formed integrally from the sheet.

Method for producing a carrier element for semiconductor chips

A method for electrically connecting a semiconductor chip to at least one contact surface uses a thin wire having a first end welded to the at least one contact surface and a second end connected to a contact zone of the semiconductor chip. In order to produce a good connection between the wire and the contact zone of the semiconductor chip, the second end of the wire is welded to a metal piece in the form of a wedge which is disposed on the contact zone of the semiconductor chip and is connected in a conductive manner thereto. The metal piece is formed by a nailhead contact having a free end which is guided in a loop and is connected to the nailhead by a wedge contact. A smart card module and a smart card are produced by the method.

Growing community of inventors

Bach, Germany

Josef Heitzer