Intel Corporation

Intel IP Corporation

Josef Hagn

Sidharth Dalmia

Omer Asaf

Trang Thuy Thai

Baljit Singh

Kameran Azadet

Shilpa Talwar

Hosein Nikopour

Bryan K Casper

Ofir Degani

Wook Bong Lee

Ashoke Ravi

Michael Genossar

Claudio Da Silva

Andreas Wolter

Stefano Pellerano

Debabani Choudhury

Rotem Banin

Albert Molina

Georgios Yorgos Palaskas

Igal Kushnir

Duncan Kitchin

Oner Orhan

Saku Lahti

Sonja Koller

Emanuel Cohen

Andreas Augustin

Mikko S Komulainen

Gadi Shor

Jayprakash Thakur

Eren Sasoglu

Arnaud Lucres Amadjikpe

Kunal Datta

Menashe Soffer

Moshe Teplitsky

Ana M Yepes

Run Levinger

Chintan S Thakkar

Eshel Gordon

Erkan Alpman

Nebil Tanzi

Ron Pongratz

Tawfiq Musah

Raanan Sover

Peter Sagazio

Eyal Goldberger

Shuhei Yamada

Amit Freiman

Yossi Tsfati

Kaushik Dasgupta

Eran Gerson

Shmuel Ravid

Marian K Verhelst

Meir Gordon

Nir Weisman

Resti Montoya Moreno

Anandaroop Chakrabarti

Jonathan Jensen

Noam Kogan

Miroslav Baryakh

Ra'anan Sover

Naftali Landsberg

Mikko M Lampinen

Avi Tsarfati

Lior Shakedd

Anat Bazov

Stefano Brenna

Saeid Daneshgar Asl

Amr M Fahim

Shinwon Kang

Te Yu Kao

Nathan G Narevsky

Simon Svendsen

Kilian Roth

Daniel R Cox

Evan A Chenelly

Gregory Chance

Bhagyashree S Ganore

Brandon Davis

Georg Seidemann

Bernd Waidhas

Thomas Wagner

Gregory W Chance

Brandon R Davis

Richard S Perry

Stephan Stoeckl

Trang Thai

Jonathan C Jensen

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

Wireless communication technology, apparatuses, and methods

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

Antenna boards and communication devices

The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.

Compact radio frequency (RF) communication modules with endfire and broadside antennas

Embodiments include semiconductor packages and methods of forming the semiconductor packages. A semiconductor package includes a die over a substrate, a first conductive layer over the die, and a conductive cavity antenna over the first conductive layer and substrate. The conductive cavity antenna includes a conductive cavity, a cavity region, and a plurality of interconnects. The conductive cavity is over the first conductive layer and surrounds the cavity region. The semiconductor package also includes a second conductive layer over the conductive cavity antenna, first conductive layer, and substrate. The conductive cavity extends vertically from the first conductive layer to the second conductive layer. The cavity region may be embedded with the conductive cavity, the first conductive layer, and the second conductive layer. The plurality of interconnects may include first, second, and third interconnects. The first interconnects may include through-mold vias (TMVs), through-silicon vias (TSVs), conductive sidewalls, or conductive trenches.

Single metal cavity antenna in package connected to an integrated transceiver front-end

Embodiments include semiconductor packages and methods of forming the semiconductor packages. A semiconductor package includes a die over a substrate, a first conductive layer over the die, and a cavity resonator antenna over the first conductive layer and substrate. The cavity resonator antenna includes a conductive cavity, a cavity region, and a plurality of interconnects. The conductive cavity is over the first conductive layer and surrounds the cavity region. The semiconductor package also includes a second conductive layer over the cavity resonator antenna, first conductive layer, and substrate. The conductive cavity may extend vertically from the first conductive layer to the second conductive layer. The cavity region may be embedded with the conductive cavity, the first conductive layer, and the second conductive layer. The plurality of interconnects may include first, second, and third interconnects. The first interconnects may include through-mold vias (TMVs), through-silicon vias (TSVs), conductive sidewalls, or conductive trenches.

Package integrated cavity resonator antenna

A patch antenna array is fabricated with a package-on-package setup that contains a transceiver. The patch antenna array has a footprint that intersects the transceiver footprint. The package-on-package setup includes through-mold vias that couple to a redistribution layer disposed between the patch antennas and the package-on-package setup.

Patch antennas stitched to systems in packages and methods of assembling same

Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.

Perpendicular end fire antennas

Growing community of inventors

Munich, Germany

Josef Hagn