Atotech Deutschland Gmbh

Institut Fur Diagnostikforschung Gmbh

Other

Atotech Deutschland Gmbh & Co. Kg

Der Freien Universitat Berline

Josef Gaida

Wolfgang Ebert

Dirk Rohde

Ralf Schmidt

Jens Palm

Himendra Jha

Wolfhard Semmler

Albrecht Uhlig

Olivier Mann

Mayk Kresse

Christof Suchentrunk

Susanne Wagner

Angela Llavona-Serrano

Detlev Pfefferer

Kun Si

Anja Herrmann

Volker Elste

Matthias Taupitz

Monika Jukl

Udo Swiderski

Onas Bolton

Frank Von Horsten

Johannes Platzek

Heinz Gries

Ulrich Niedballa

Heiko Brunner

Jurgen Conrad

Olaf Kurtz

Jürgen Barthelmes

Jan Sperling

Robert Rüther

Stefanie Ackermann

Thomas Moritz

Fabian Michalik

Norbert Lützow

Grigory Vazhenin

Franz Karl Maier

Mary Lee-Vaupel

Gabriela Schmidt

Mauro Castellani

Christoph Stephan Hilger

R&uuml;diger Lawaczek

Thomas Hülsmann

Rudiger Lawaczek

Willi Rohland

Florence Lagorce-Broc

Oleg Sprenger

Marta Sainz-Vila

Michael Boyle

Brian Washo

Frank Von-Horsten

Mike Boyle

The present invention relates to a composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising:

Acidic aqueous composition for electrolytic copper plating

The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising

Acidic aqueous composition for electrolytically depositing a copper deposit

An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising 

Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy

The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising 

An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each Ris a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.

Etching solution for copper and copper alloy surfaces

The present invention concerns thin diffusion barriers in metal and metal alloy layer sequences of contact area/barrier layer/first bonding layer type for metal wire bonding applications. The diffusion barrier is selected from Co-M-P. Co-M-B and Co-M-B&#x2014;P alloys wherein M is selected from Mn, Zr, Re, Mo, Ta and W having a thickness in the range 0.03 to 0.3 &#x3bc;m. The first bonding layer is selected from palladium and palladium alloys.

Wire bondable surface for microelectronic devices

A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.

Electrodeposition method with analysis of the electrolytic bath by solid phase extraction

The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni&#x2014;P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni&#x2014;P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni&#x2014;P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni&#x2014;P/Pd stack is not higher than 34.48M&#x2212;Pa (5,000 psi). Further, a process for the preparation of such a substrate is described.

Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces

Iron-containing nanoparticles with double coating and their use in diagnosis and therapy

Iron-containing nanoparticles with double coating and their use in

3-,8-substituted deuteroporphyrin derivatives, pharmaceutical agents

Growing community of inventors

Berlin, Germany

Josef Gaida