Texas Instruments Corporation

Jose Antonio Martinez

Sean Christopher O'Brien

Lucius Marshall Sherwin

Ronald Charles Roth

Stephen Howard Looney

A microelectromechanical system (MEMS) structure includes at least first and second metal vias. Each of the first and second metal vias includes a respective planar metal layer having a first thickness and a respective post formed from the planar metal layer. The post has a sidewall, and the sidewall has a second thickness greater than 14% of the first thickness.

Microelectromechanical system (MEMS) structure and method of formation

In described examples, a cavity is formed between a substrate and a cap. One or more access holes are formed through the cap for removing portions of a sacrificial layer from within the cavity. A cover is supported by the cap, where the cover is for occulting the one or more access holes along a perspective. An encapsulant seals the cavity, where the encapsulant encapsulates the cover and the one or more access holes.

Microelectromechanical system cavity packaging

Described examples include a micromechanical device including a substrate and a base formed on a surface of the substrate; and a first layer extending from the base to a plane separated from the base by a via. The first layer forms an outer layer of the via and has a portion lying in the plane and surrounding the via. A first fill is formed in a first portion of the via. A strut is in the via and on the first fill. A second fill is in a second portion of the via on the strut and extends from the strut to the plane. A second layer is over the second fill and at least a portion of the second layer is over the portion of the first layer lying in the plane.

Micromechanical device with via strut

A microelectromechanical (MEMS) device has a movable member supported above a substrate on a via support. The member and via support are fabricated integrally from first and second member forming layers. A first member forming layer forms a lower part of the member and supporting structure for the via support. First and second fill layers are deposited and patterned to form a plug that fills an inner cavity opening in the via structure. The plug is planarized to a planar part of the first member forming layer, and a second member forming layer is deposited over the first member forming layer and the planarized plug to form an upper part of the member. The via support may have a cavity filled by BARC layers.

Growing community of inventors

Murphy, TX, United States of America

Jose Antonio Martinez