Lear Corporation

Other

Jose Antonio Cubero Pitel

Montserrat Pinol Pedret

Miguel Saiz Garcia

Joan Ignasi Ferran Palau

Ferran Juanes Ribas

Antoni Pujol Simon

Jordi Claramunt Blanco

Xavier Carbonell Maté

Ferran J Ribas

Andreu Fores Montserrat

Maria Leonor Torrijos Ezquerra

Enric A Rollan

Montserrat P Pedret

A fluid vessel assembly is provided with a first vessel body with a first mating surface with a first plurality of generally planar nonparallel regions. The first vessel body forms a first portion of a fluid cavity. A second vessel body is provided with a second mating surface with a second plurality of generally planar nonparallel regions sized to engage the first mating surface. The second vessel body forms a second portion of the fluid cavity. The first mating surface and the second mating surface are friction stir welded together.

Fluid vessel assembly with welded connection

An electrical connector includes a connector housing configured for attachment to an electrical enclosure. A first side of the connector housing faces an inside of the electrical enclosure and a second side of the connector housing faces an outside of the electrical enclosure. The connector housing may include a connector aperture configured to receive an electrical conductor, which may extend between the first and second sides of the connector housing. The connector housing may further include a ventilation pathway separate from the connector aperture that defines a fluid communication path between the first side and the second side of the connector housing.

Vented electrical connector

An electrical unit includes a housing member, a circuit board, a header connected to the housing member, and a plurality of electrical terminals disposed in the header and connected to the circuit board. The header may be connected to the housing member such that movement of the header is restricted and forces applied to the circuit board via the housing member are limited. The header may include a retainer configured to retain the header relative to the housing member. The housing member may include a latch configured to engage the retainer.

Electrical unit and header retention system therefor

A housing is described that may include a main portion having at least one wall defining an opening that may have a perimeter. The at least one wall may have a rib and an inner wall extending therefrom about the perimeter of the opening. The inner wall may have an air relief slot formed therein. The housing may further include a cover. The cover may have an edge defining a perimeter. The cover may include a rib extending from the edge about the perimeter of the cover. The main portion rib, the inner wall and the cover rib may cooperate for attachment of the cover to the main portion and to define an air chamber between the cover rib and the inner wall.

Housing with air chamber for battery monitor system and method for manufacturing same

A method is provided for producing a printed circuit board. The method includes the step of providing an insulating substrate having a layer of aluminum material applied to the substrate. A portion of the layer of aluminum material is removed for defining a circuit trace. A layer of conductive material is applied to the layer of aluminum material.

Method for producing a printed circuit board

Manufacturing process for manufacturing printed circuit boards from an extruded polymer, comprising the steps:-preparing an electro-conductive plate () and form embossments () by means of selective engraving on a first side (), corresponding to future tracks and depressions () corresponding to future inter-track areas;-applying a dielectric substrate material, in a pasty or semi-pasty state, according to a first sheet () obtained by extrusion of a thermal-plastic material, arranging it on said first side (), covering said embossments () and filling said depressions (), and subjecting the first sheet () and plate () assembly to a predetermined pressure so that the dielectric substrate material completely fills said depressions and encloses said embossments (), and-on the hardened dielectric substrate, carrying out a second selective engraving on a side opposite the first side (), removing the material corresponding to said future inter-track areas.

Method for manufacturing printed circuit boards from an extruded polymer

It comprises the steps of: a) arranging a dielectric substrate () with at least one conducting plate () joined by an adhesive () to at least one of its sides; b) removing areas of said plate () by selective chemical milling to provide conducting tracks () joined to the substrate () and separated by spaces between tracks (); c) applying and hardening by radiation an electroinsulating filler material () to fill said spaces between tracks (), covering the tracks (); d) applying an abrasion treatment to obtain flush upper surfaces () of the filler material () and of the tracks; and e) cooling, after step c) and during step d), the printed circuit board to reduce the temperature of the filler material () to under its glass transition temperature.

Process for manufacturing printed circuit boards with protected spaces between tracks

The proposed procedure, that of laser soldering or welding, is an auto-energetic process in which the density of the laser beam is obtained because of the concentration of light beams. Said process involves two metals (alike or disimilar) and, previously to the metallurgical union, same must be positioned in front of the laser head with enough accuracy. The metallurgical union is carried out by direct fusion of the metals to be joined and not being therefore necessary to use any filler metal.

Growing community of inventors

Valls, Spain

Jose Antonio Cubero Pitel