Mahle International Gmbh

Jose Antonio Castillo

Francisco Gonzalez Espin

Christoph Walter

Jens Bruckner

Alfredo Perez

Torbjorn Hallberg

Manuel Klingler

Donato Jordan Herrero

The present disclosure concerns a mounting device for semiconductor packages, and a heat dissipation assembly with such a mounting device. The mounting device includes a bottom side comprising one or more cavities to house semiconductor packages, and a top side comprising a plurality of holes extending from the bottom side to the top side for accommodating contact pins of the semiconductor packages. A fixation mechanism fixes the mounting device to a heat dissipation structure.

Mounting devices for semiconductor packages with a fixation mechanism

The present disclosure relates to a power electronic device for a vehicle. The power electronic device includes at least one intermediate unit having at least one fluid duct system fluidically connected to a fluid inlet and a fluid outlet, at least one power electronic unit arranged at least at a surface of the at least one intermediate unit, and at least one heating device arranged at least at a surface of the at least one intermediate unit.

Power electric device for a vehicle

Growing community of inventors

San Antonio de Benageber, Spain

Jose Antonio Castillo