Innomedia Pte Ltd.

Cloudshield Technologies, Inc.

Jose Alvarellos

Peder J Jungck

Zahid Najam

Nan-Sheng Lin

Jixue J Liu

Chinpyng J Tzeng

Shailesh Patel

Thuan Luong

An electronic device with improved heat dissipation properties comprises metallic housing. A base circuit board may be positioned within the housing in a plane parallel to the backside. Multiple connectors for coupling cassettes to the base circuit board may be positioned about the periphery of the base circuit board such that multiple cassettes may be positioned adjacent to each side of the housing. Each cassette includes a printed circuit board with a plurality of heat generating components coupled to the printed circuit board and having a thickness extending towards the side of the housing. The cassette includes a metallic housing with a heat dissipation structure contacting: i) the side of the housing; and ii) each heat generating component. Each of at least two heat generating components have different thicknesses and the heat dissipation structure had different thicknesses between the side of the housing and each heat generating component.

Electronic device with improved heat dissipation properties

A system and method for distributing power to multiple circuit boards coupled with a &ldquo;system&rdquo; backplane is disclosed. Separate redundant pairs of power supplies are provided for each circuit board in a load sharing arrangement. Each set of power supplies and their load, i.e. the circuit board to which they are coupled and providing power to, are isolated from the other sets. The power supplies are coupled with a second &ldquo;power&rdquo; backplane which interconnects the redundant power supply pairs as well as receives the input voltage and current from a source and distributes it to all of the power supplies. The power backplane is further coupled with the system backplane in a back to back arrangement to effect the connection of the power supplies with their respective loads. The redundant power supplies in combination with fault monitoring and failure handling logic identify and isolate faults, enable fail-over operation and prevent collateral damage to other system components.

System and method for distributed power supply supporting high currents with redundancy

Growing community of inventors

Fremont, CA, United States of America

Jose Alvarellos