The Dexter Corporation

Quantum Materials Corporation

Quantum Materials/dexter Corporation

Jose A Osuna

Stephen M Dershem

Dennis B Patterson

In accordance with the present invention, there are provided low viscosity acrylate monomers, and compositions based on same having low moisture resistance (and, hence are much less prone to give rise to &ldquo;popcorning&rdquo;), excellent handling properties (i.e., generally existing as a fluid material which does not require the addition of solvent to facilitate the use thereof), and excellent performance properties (e.g., good dielectric properties).

Low viscosity acrylate monomers formulations containing same and uses therefor

In accordance with the present invention, there are provided compositions based on defined hydrophobic vinyl monomers have excellent moisture resistance (and, hence are much less prone to give rise to 'popcorning'), excellent handling properties (i.e., generally existing as a fluid material which does not require the addition of solvent to facilitate the use thereof), and excellent performance properties (e.g., good dielectric properties).

Hydrophobic vinyl monomers, formulations containing same, and uses

In accordance with the present invention, there are provided novel adhesive compositions which do not require solvent to provide a system having suitable viscosity for convenient handling and cure rapidly. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and good adhesion to both the substrate and the device attached thereto.

Bismaleimide-divinyl adhesive compositions and uses therefor

In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Thermosetting resin compositions containing maleimide and/or vinyl

In accordance with the present invention, there are provided novel propargyl ether-based compositions that are very effective when used in underfill applications. Aromatic propargyl ether compounds are believed to represent the most robust resin chemistry currently available to meet the many performance requirements associated with underfill applications. Propargyl ether resins are hydrophobic, hydrolytically stable, low toxicity monomers that can be cured to high T.sub.g, thermally stable thermosets. Liquid propargyl ether monomers have been found and/or described in the literature which can be used alone or in combination to yield diluent free underfill compositions. Alternatively, mixtures of two or more propargyl ether monomers (wherein one or more of these monomers may be solids at room temperature) can be used to create diluent-free, room temperature stable, eutectic or peritectic liquid resin compositions. In accordance with the present invention it has furthermore been found that transition metal compounds (in chelated or soap forms) can be used to catalyze the rapid cure of propargyl ether monomers. This cure is especially facile in the presence of additional coordinating ligand additives.

Propargyl ether-containing compositions useful for underfill applications

An adhesive bonding composition with bond line limiting spacer system includes an adhesive paste composition having a hardenable adhesive component, and a plurality of spacer elements distributed in the adhesive paste composition. The spacer elements are sized to provide a self-limiting bond line thickness between the surfaces to be bonded, the bond line thickness being maintained at a selected lower limit by the spacer elements.

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San Diego, CA, United States of America

Jose A Osuna