At&t Bell Laboratories

Jose A Ors

Treliant Fang

Jane Deborah LeGrange

John J Burack

Venkataram Reddy Raju

Akshay V Shah

Brent J Blumenstock

Paula J Brown

A triazine-based mixture, used as a multichip module device dielectric (14), is made more robust and more resistant to temperature extremes by making it to be of from twenty to sixty percent by weight of triazine and of one to ten percent by weight of siloxane-caprolactone copolymer. The foregoing mixture can be made to have a higher resolution by including zero to twenty percent by weight of novolak epoxy acrylate. The entire mixture preferably additionally comprises two to eight percent by weight of bisphenol-A diglycidyl ether monoepoxyacrylate, zero to twenty percent by weight of carboxyl-terminated butadiene nitrile rubber, two to six percent of N-vinylpyrrolidone, one to ten percent of trimethylolpropanetriacrylate, zero to five weight percent glycidoxypropyltrimethoxysilane, 0.05 to five weight percent photoinitiator, zero to two percent pigment, 0.1 to one percent surfactant, zero to 0.3 percent copper benzoylacetonate, and thirty to fifty percent solvent.

Method of making circuit devices comprising a dielectric layer of

An optical waveguide (11) is composed substantially entirely of triazine.

Triazine optical waveguides

An optical waveguide (11) is composed substantially entirely of triazine. Various methods for making desired triazine waveguide patterns are described.

Method of making triazine optical waveguides

The specification describes a process for making a plating mask (17), for use in printed wiring board fabrication, with greater precision and definition than has previously been possible. An insulative substrate (11) includes on one surface a thin metal film (13). The film is covered with a relatively thick first mask layer (16) which is selectively removed to expose portions of the metal film, which are in turn removed to expose portions of the insulative substrate (11). The exposed portions of the insulative substrate are covered with a relatively thick plating mask layer (17) which abuts against the first mask layer (16). The first mask layer is then removed, leaving the remaining plating mask layer as a patterned plating mask which is then used as a mask for deposited metal (19) which defines a printed circuit.

Growing community of inventors

New Hope, PA, United States of America

Jose A Ors