Abb Schweiz Ag

Abb Technology Oy

Jorma Manninen

Mika Silvennoinen

Joni Pakarinen

Timo Koivuluoma

Kjell Ingman

Jaani Kärppä

Pirkka Myllykoski

Tuomas Kemppainen

Tuomo Kinnunen

Heikki Mörsky

A power electronic assembly includes a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

Cooling arrangement

A heatsink assembly, a method of producing a heat sink assembly and an electrical device. The heatsink assembly including a heatsink having a surface for receiving a heat source, a copper insert and a layer of low density pyrolytic graphite. The copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and the heat transferring assembly is adapted to receive a heat source for transferring the heat from the heat source to the heatsink.

Heatsink assembly, method of manufacturing a heatsink assembly, and an electrical device

A converter and a method of manufacturing a converter. The converter includes electrical components and a cover enclosing a first group of the electrical components of the converter, wherein a second group of the electrical components are printed electrical components which are embedded in the cover of the converter. The cover of the converter includes a user interface, and the user interface includes printed electrical components from the second group of electrical components.

Converter

A power electronic component including a surface adapted to be attached to a heatsink, the surface forming a bottom surface of the power electronic component, one or more power electronic semiconductor chips mounted on a substrate above the bottom surface, and a housing enclosing the one or more power electronic semiconductor chips. The power electronic component includes a thermal insulator disposed above the one or more power electronic semiconductor chips, such that the bottom surface and the thermal insulator are on the opposite sides of the one or more power electronic semiconductor chips.

Power electronic module

A power electronics module and a method of producing a power electronics module. The power electronics module includes multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted to receive a surface of a cooling device, wherein the heat transfer structure includes a compressible base plate.

Power electronics module and a method of producing a power electronics module

A cooling apparatus is disclosed with a base plate for receiving a heat load from an electric component, an evaporator, a condenser, and a connecting piece for passing fluid from the evaporator to the condenser. In order to efficiently fill the evaporator, the cooling apparatus is provided with a pump for pumping fluid from the condenser to the evaporator.

Cooling apparatus with multiple pumps

A power electronics module and a method of manufacturing a power electronics module and a base plate. The power electronics module comprising at least one power electronics component, wherein the power electronics module comprises a base plate for transferring heat generated by the at least one power electronics component to a cooling device, the base plate comprising a layered structure having a first copper layer, a second copper layer and a carbon based layer between the first and second copper layers.

Power electronics module

A method of producing a power electronic assembly and a power electronic assembly including a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module including a base plate with a bottom surface, the power electronic assembly includes further a cooling arrangement for cooling the power electronic module, the cooling arrangement including a cooling surface adapted to be attached against the bottom surface of the base plate of the power electronic module, wherein the power electronic assembly includes further a thermal interface material arranged between the bottom surface of the base plate of the power electronic module and the cooling surface of the cooling arrangement to transfer heat from the power electronic module to the cooling arrangement, the thermal interface material includes a metal foil and a solid lubricant coating.

Power electronic assembly

Exemplary embodiments are directed to an equipment space that is a closed space provided with electrical equipment and an air dryer condensing the moisture of the air in the equipment space into water. A system for removing water from the equipment space includes a porous element having a capillary structure and being located in an outlet opening of the equipment space. The porous element is connected such that water condensed by the air dryer is directed to a first inner surface of the porous element. The capillary structure of the porous element is configured to propogate water from the inner surface of the porous element to an outer surface of the porous element. The outer surface of the porous element is configured to release water to ambient air outside the equipment space.

Growing community of inventors

Vantaa, Finland

Jorma Manninen