Hitachi Global Storage Technologies Netherlands B.v.

Jorge Rubio

Russell Dean Moates

Peter Michael Baumgart

Gurinder P Singh

Iraj Kavosh

A method of utilizing a solder reflow channel in the formation of a hard disk drive is disclosed. The method provides a first hard disk drive component having at least one solder reflow channel, the at least one solder reflow channel for retaining a predeposited solder material. The solder reflow channel is utilized to provide a solder location for coupling the first hard disk drive component and a second hard disk drive component to the predeposited solder material.

Method of utilizing a solder reflow channel in the formation of a hard disk drive

A method of swaging a head gimbal assembly (HGA) to an actuator arm comprises positioning a tubular element on the HGA adjacent a hole in the actuator arm; restraining the subassembly; providing a rod formed from a shape memory alloy (SMA), the SMA having a martensitic phase at a low temperature and an austenitic phase above a phase transition temperature that is higher than the low temperature, the rod having an initial diameter that is smaller than diameters of the tubular element and the hole; extending the rod through the tubular element and hole; heating the rod above the phase transition temperature such that the rod expands to a second diameter that is greater than the initial diameter to plastically deform the HGA and swage together the HGA and actuator arm to form an assembly; cooling the rod and removing the rod from the assembly such that the rod returns to the initial diameter.

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San Jose, CA, United States of America

Jorge Rubio