Kla-tencor Technologies Corporation

Meprolight (1990) Ltd

Jorge Poplawski

Michael E Adel

Mark Ghinovker

Joel L Seligson

Chris Mack

Moshe E Preil

John Charles Robinson

Boris Golovanevsky

Pavel Izikson

Elyakim Kassel

Doron Segal

A weapon sight, including a photon energy harvesting device configured to accept photon energy from light surrounding the weapon sight, an electrical energy storing element configured to store electrical energy from the photon energy harvesting device in the form of an electric field, a load configured to be powered by the electrical energy storing element, a voltage regulator configured to limit the release rate of current from the electrical energy storing element to power the load.

Renewable energy powered weapon sight

Disclosed are techniques and apparatus are provided for determining overlay error or pattern placement error (PPE) across the field of a scanner which is used to pattern a sample, such as a semiconductor wafer or device. This determination is performed in-line on the product wafer or device. That is, the targets on which overlay or PPE measurements are performed are provided on the product wafer or device itself. The targets are either distributed across the field by placing the targets within the active area or by distributing the targets along the streets (the strips or scribe areas) which are between the dies of a field. The resulting overlay or PPE that is obtained from targets distributed across the field may then be used in a number of ways to improve the fabrication process for producing the sample. For instance, the resulting overlay or PPE may be used to more accurately predict device performance and yield, more accurately correct a deviating photolithography scanning tool, or determine wafer lot disposition.

Apparatus and methods for determining overlay and uses of same

An overlay method for determining the overlay error of a device structure formed during semiconductor processing is disclosed. The overlay method includes producing calibration data that contains overlay information relating the overlay error of a first target at a first location to the overlay error of a second target at a second location for a given set of process conditions. The overlay method also includes producing production data that contains overlay information associated with a production target formed with the device structure. The overlay method further includes correcting the overlay error of the production target based on the calibration data.

Overlay metrology and control method

Growing community of inventors

Haifa, Israel

Jorge Poplawski