Other

Jorge M Herandez

Scott S Simpson

Michael S Hyslop

A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted onto the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.

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Mesa, AZ, United States of America

Jorge M Herandez