Intel Corporation

Jorge Contreras Perez

Je-Young Chang

Jeffory L Smalley

Sandeep Ahuja

Thomas A Boyd

Phil Geng

Susan F Smith

Shrenik Kothari

Shelby A Ferguson

Mustafa H Haswarey

Rolf Laido

Andres Ramirez Macias

Divya Swamy Bandaru

Gilberto Rayas Paredes

Francisco Gabriel Lozano Sanchez

Maria De La Luz Belmont Velazquez

An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

Multi-surface heat sink suitable for multi-chip packages

A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.

Method and apparatus for detaching a microprocessor from a heat sink

Growing community of inventors

Zapopan, Mexico

Jorge Contreras Perez