Siemens Aktiengesellschaft

Infineon Technologies Ag

Siemens Medical Solutions Usa, Inc.

Osram Opto Semiconductors Gmbh

Epcos Ag

Siemens Aktiengesell Schaft

Polyic Gmbh & Co Kg

Pyreos Ltd.

Robert Boschgmbh

Siemens Healthcare Gmbh

Jörg Zapf

Karl Weidner

Harry Hedler

Norbert Seliger

Carsten Schuh

Stefan Stegmeier

Florian Poprawa

Andreas Wolff

Markus Schieber

Markus Vester

Andreas Wolter

Maximilian Fleischer

Jörg Erich Sorg

Axel Ganster

Susanne Kornely

Andreas Lenk

Stefan Denneler

Franziska Lambrecht

Christina Schindler

Jens Dahl Jensen

Hellmut Freudenberg

Walter Fix

Klaus Huber

Randolf Mock

Harald Schweigert

Christoph Hamann

Wolfgang Clemens

Herbert Schwarzbauer

Axel Kaltenbacher

Heiner Bayer

Carsten Giebeler

Günter Lugert

Matthias Schreiter

Stefan Von Dosky

Stefan Klehr

Jürgen Zettner

Thomas Licht

Eckhard Wolfgang

Kerstin Wiesner

Robert Weinke

Albrecht Donat

Piotr Strauch

Daniel Evers

Michael Kaspar

Franz Auerbach

Oliver Hennig

Gernot Schimetta

Ewald Karl Michael Günther

Markus Schwarz

Erik Weisbrod

Jörg-Erich Sorg

Oliver Freudenberg

Matthias Rebhan

Andreas Peschka

Sebastian Kisban

Markus Lasch

Thomas Neuhauser

Xuanming Lu

Andrea Deutinger

Hubert Baueregger

Laurence Amigues

Oliver Raab

Michael Schiffer

Manfred Schreiner

Andreas Mantovan

Bernd Gutsmann

Ewald Gunther

Kerstin Häse

Hans Santos Wilke

Ewald Günther

Various embodiments of the teachings herein include an electronic module comprising: a circuit carrier with an electrically conductive thick film with a thickness of at least 0.5 millimeter; and a plurality of thermally conductive elements connected to one another by a thermally conductive material. The thermally conductive elements have a base area with rotational symmetry.

Electronic module, method for producing an electronic module, and industrial plant

Various embodiments of the teachings herein include a rectifier. The rectifier may include: a rectifier circuit formed with current valves with microelectromechanical systems (MEMS) switches; and a switching controller driving the MEMS switches to switch and open. The switching controller opens the MEMS switches when a voltage feeding the rectifier falls below a minimum distance from a zero voltage.

Rectifier and power supply device

A thermoresistive gas sensor, e.g. for a flow sensor or a thermal conductivity detector, has a lattice with lattice webs, which consist of a semiconductor material arranged in the plane of the lattice in parallel next to one another, wherein the semiconductor material is formed on a plate-shaped semiconductor substrate that extends over a window-like cutout in the semiconductor substrate and forms the lattice, where the semiconductor layer is doped outside the cutout in areas of two ends of the lattice at least over the width of the lattice until it degenerates and/or bears metallizations, where the semiconductor layer further contains a separation structure insulating the two ends of the lattice from one another, in which the semiconductor material is removed or is not doped, and where the lattice webs extend in an S shape and are connected electrically in parallel to achieve a high measurement sensitivity and mechanical stability.

Thermoresistive gas sensor

The invention relates to a circuit carrier (), comprising a digital circuit, which contains at least two components () that are electrically connected to each other (). Additionally, an electric shield () is provided. According to the invention, the electric shield () and a conducting path () for electrically connecting the components () are realized by means of a single layered composite (). In particular, the electric shield () and the conducting path () are formed by the same electrically conductive layer, wherein a hole () ensures complete electrical insulation of the conducting path () from the shield (). The invention further relates to a method for producing such a circuit carrier.

Circuit carrier having a conducting path and an electric shield

A three-dimensional micro-structure has a plurality of adjacent micro-columns which are arranged at a distance from each other and essentially parallel in relation to the respective longitudinal extension. The micro-columns are made of at least one micro-column material having respectively an aspect ratio in the region of 20-1000 and respectively a micro-column diameter in the region of 0.1 &#x3bc;m-200 &#x3bc;m. A micro-column intermediate chamber is arranged between adjacent micro-columns having a micro-column distance selected from between the adjacent micro-columns in the region of 1 &#x3bc;m-100 &#x3bc;m. According to a method for producing the three-dimensional micro-structures: a) a template is provided with template material, b) the micro-column material is arranged in the column-like cavities, and c) the template is at least partially removed.

Thermoelement including a three-dimensional microstructure, and method for producing a thermoelement

A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.

Micromechanical measuring element and method for producing a micromechanical measuring element

An ultrasound transducer array is formed with stealth dicing. A laser is used to form defects within the piezoelectric substrate and along the desired kerf locations. The substrate is fractured along the defects. A controlled expansion, such as using thermal expansion, may be used to establish the desired kerf width. Spacers may be used to maintain the desired kerf width. The kerfs are filled to create the ultrasound transducer array.

Method for forming an ultrasound transducer array

At least two separate single-crystal silicon layers are formed in a micromechanical substrate which has a diaphragm in a partial region. The diaphragm has a thickness of less than 20 &#x3bc;m and includes part of a first of the single-crystal silicon layers. The substrate construction also includes a heating element configured to generate a temperature of more than 650&#xb0; C. in at least part of the diaphragm. The substrate includes at least one diffusion barrier layer that reduces the oxidation of the first single-crystal silicon layer.

Micromechanical substrate for a diaphragm with a diffusion barrier layer

The present embodiments relate to a magnetic resonance local coil with a receive antenna for receiving magnetic resonance signals. The magnetic resonance local coil also includes a transmission unit for transmitting magnetic resonance signal data generated on the basis of the magnetic resonance signals via a data transmit antenna of the magnetic resonance local coil to a signal data receiving unit of a magnetic resonance tomography systems. The transmission unit is provided, at least in sections, with screening with a first metal coating and a first dielectric coating.

Magnetic resonance local coil

In a device for the detection of thermal radiation and a method for production of such a device, a stack is formed with a detector support having a detector element for converting the thermal radiation into an electric signal, a circuit support with a read-out circuit for reading out the electrical signal and a cover to shield the detector element. The detector support and the cover are so arranged that a first stack cavity is formed between the detector element and the cover and a second stack cavity is formed between detector support and the circuit support. The first stack cavity and/or the second stack cavity is evacuated and hermetically sealed. In the manufacturing operation, functionalized silicon-substrates are stacked upon one another, firmly bonded together and subsequently sub-divided. Preferably, the detector elements are pyro-electric detector elements. The device finds application in motion detectors, presence reporters and thermal-image cameras.

Device with a sandwich structure for detecting thermal radiation, and method for the production thereof

One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

Method for contacting electronic components by means of a substrate plate

The embodiments relate to a piezoelectric component including at least one fully active piezoelectric element comprising electrode layers and piezoelectric layers arranged therebetween. The electrode layers are conveyed to a lateral edge of the piezoelectric element and contacted there. The external electrode is attached in a structured fashion for electrical contacting and/or a structured external electrode is made available: The external electrode essentially includes two components, namely the contacting field and the contacting path. In the event of several piezoelectric elements (piezoelectric actuator in multilayer structure) stacked one above the other, the contacting path functions as a collector electrode, which connects the contacting fields of the piezoelectric elements to one another. The insulation path exists for the electrical insulation of the contacting path from electrode layers which are not to be contacted. A reliable contacting of the electrode layers is possible with the structure according to the invention. A fully active, piezoceramic multilayer actuator with the described contacting is used in automotive engineering for activating fuel injection valves.

Piezoelectric component with directly structured external contacting, method for manufacturing the component and use of said component

A piezoelectric component with at least one fully active piezoelement has electrode layers and interposed piezoelectric layers guided to a lateral edge of the piezoelement and contacted there. An insulating layer applied for electric contacting has an electric through-plating. An electrically conductive gas-phase deposition layer is applied directly to the electrode layer guided up to the lateral surface of the piezoelement by way of deposition from the gas phase in order to improve electric contacting. An external electrode is applied to the gas-phase deposition layer. In the case of several superposed stacked piezoelements (piezoactuator in multi-layer design), the external electrode functions as a collector electrode which connects the electrode layers to each other. The structure enables secure contacting of the electrode layers. A fully active piezoceramic multi-layer actuator with the described contacting may be used in automobile technology for activating fuel-injection valves.

Piezoelectric component with outer contacting, having gas-phase deposition, method for manufacturing component and use of component

According to various production methods for producing a piezoceramic multilayer actuator, in the course of the production method, multilayer locks () are electrochemically or mechanically processed in such a way that a recess structure is obtained. The lateral surfaces () of the electrodes () inside these recesses are electrically insulated using the slip casting method in order to be able to contact the remaining electrodes by imprinting an outer metallization.

Piezoceramic multilayer actuator and method for the production thereof

A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

Device having a contacting structure

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Munich, Germany

Jörg Zapf