Hewlett-packard Development Company, L.p.

Jordi Gimenez Manent

Fernando Juan

Pau Martin Vidal

Marius Valles

Jose Manuel Grases

Francisco Jaime

Esteve Comas

Xavier Gasso Puchal

William F Winters

Brent Ewald

Pablo Dominguez Pastor

Eduardo Ruiz Martinez

Haseeb Yusef

Pol Morral

Drew Berwager

Micah Aberth

According to one example there is provided a method of delivering build material from a build material store to a supply module. The method comprises moving, using a rotatable vane, a portion of build material from the supply module to the top of the supply module, and spreading the moved portion of build material across the support platform.

Supplying build material

A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.

Removable 3D build module comprising a memory

According to an example, a recoater for a three-dimensional (3D) printer may include a cylindrical element having a surface to spread build material particles. The build material particles may have a specified average dimension and the surface may include a plurality of depressions that have dimensions that are smaller than the specified average dimension of the build material particles.

Recoater for 3D printers

A method of delivering build material from a build material store () to a supply module (). The method comprises moving, using a rotatable vane (), a portion of build material from the supply module () to the top of the supply module (), and spreading the moved portion of build material across the support platform ().

Growing community of inventors

Rubi, Spain

Jordi Gimenez Manent