Basf Se Corporation

Relypsa, Inc.

Jordan Kopping

YongQi Mu

Scott J Hecker

Paul Mansky

Eric F Connor

Michael James Cope

Kalpesh N Biyani

Jun Shao

David E Bergbreiter

Deidre Madsen

Faleh Salaymeh

Angela Lee

Elizabeth Goka

Inez Lees

Hongmin Zhang

Patrice Bujard

Emmanuel Martin

Hans Jürg Kirner

Claus Gabriel

Jean-Charles Flores

Grace Huynh

Bruno Inderbitzin

Grace May

The invention relates to a filament comprising a core material (CM) comprising a fibrous filler (FF) and a thermoplastic polymer (TP1), and the core material (CM) is coated with a layer of shell material (SM) comprising a thermoplastic polymer (TP2). Further, the invention relates to a process for the preparation of said filament, as well as to three-dimensional objects and a process for the preparation thereof.

Filaments based on a core material comprising a fibrous filler

The present invention provides a crosslinked amine and amide polymers effective for binding and removing bile salts from the gastrointestinal tract. These bile acid binding polymers or pharmaceutical compositions thereof can be administered to subjects to treat various conditions, including hypercholesteremia, diabetes, pruritis, irritable bowel syndrome-diarrhea (IBS-D), bile acid malabsorption, and the like.

Crosslinked polyvinylamine, polyallylamine, and polyethyleneimine for use as bile acid sequestrants

The present invention relates to an electronic device comprising a dielectric material, which dielectric material comprises a copolymer comprising styrene and maleimic acid and derivatives thereof as structural units, a process for the preparation of the electronic device and to the use of the copolymer as dielectric material, especially as dielectric layer in printed electronic devices such as capacitors and organic field-effect transistors.

Soluble cyclic imides containing polymers as dielectrics in organic electronic applications

Growing community of inventors

Weinheim, Germany

Jordan Kopping