Other

Interuniversitair Micro-electronica Centrum, Vzw

Siemens N.v.

Sioen Industries

Siemens N.v. and Interuniversitair Micro-electronica Centrum Vzw

Sioen Industries Nv

Joost Wille

Eric Beyne

Marcel Heerman

Jean Joseph Roggen

Jozef Van Puymbroeck

Rita Van Hoof

Bert Groenendaal

Rita Hoof Van

Jozef Puymbroeck Van

David De Smet

Guy Buyle

Freek Van Den Heuvel

The invention relates to a method for embedding a non-embedded or bare LED network. To this end, the method of embedding a non-embedded LED network comprises the steps of: &#x2022;(a) providing said non-embedded LED network associated with a continuous flexible support; &#x2022;(b) applying in a continuous manner a flexible insulation layer on a liquid basis onto said non-embedded LED network associated with said continuous flexible support.

Method for embedding a LED network

A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.

Polymer stud grid array

Growing community of inventors

Loppem, Belgium

Joost Wille