Samsung Electronics Co., Ltd.

Joonyoung Oh

Dongok Kwak

Tae-Young Lee

Sang Sub Song

Boseong Kim

Junghoon Kim

Jinyoung Choi

Heeyoub Kang

Won-hwa Lee

Jae-Woo Jeong

Jaebum Byun

A method of fabricating a semiconductor package includes preparing a panel package including a redistribution substrate, a connection substrate and a plurality of lower semiconductor chips; sawing the panel package to form a plurality of separated strip packages each of which includes the sawed redistribution substrate, at least two of the lower semiconductor chips, and the sawed connection substrate; and providing a plurality of upper semiconductor chips on one of the strip packages to electrically connect the upper semiconductor chips to the sawed connection substrate.

Method of fabricating semiconductor package and semiconductor package

A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.

Semiconductor module

Growing community of inventors

Gyeonggi-do, South Korea

Joonyoung Oh