Semiconductor Components Industries, LLC

Fairchild Semiconductor Corporation

Joonseo Son

Seungwon Im

Oseob Jeon

Mankyo Jong

Byoungok Lee

Olaf Zschieschang

Dukyong Lee

Changyoung Park

Yoonsoo Lee

Keunhyuk Lee

Implementations of semiconductor packages may include: a first substrate having a first dielectric layer coupled between a first metal layer and a second metal layer; a second substrate having a second dielectric layer coupled between a third metal layer and a fourth metal layer. A first die may be coupled with a first electrical spacer coupled in a space between and coupled with the first substrate and the second substrate and a second die may be coupled with a second electrical spacer coupled in a space between and coupled with the first substrate and the second substrate.

Semiconductor package and related methods

Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

Integrated circuit direct cooling systems having substrates in contact with a cooling medium

A method can include coupling a semiconductor chip and an electrode with a substrate. Bottom and top mold die can be use, where the top mold die define a first space and a second space that is separated from the first space. The method can include injecting encapsulation material to form an encapsulation member coupled to and covering at least a portion of the substrate. The encapsulation member can include a housing unit housing the electrode. The electrode can have a conductive sidewall exposed to, and not in contact with the encapsulation member, such that there is open space between the conductive sidewall of the electrode and the encapsulation member from an uppermost surface to a bottommost surface of the encapsulation member, the substrate can having a portion exposed within the open space, and the encapsulation member can have an open cross-section perpendicular to an upper surface of the substrate.

Power module package and method of manufacturing the same

Semiconductor package having a spacer with a junction cooling pipe

In one general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate and defining an opening. The apparatus can include a one-body clip having a first portion disposed within the opening and coupled to the semiconductor die. The one-body clip can have a second portion disposed within the same opening and coupled to the substrate.

Semiconductor die package including a one-body clip

Semiconductor package having junction cooling pipes embedded in substrates

In a general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate. The apparatus can include a conductive clip coupled to the semiconductor die. The leadframe can be disposed between the semiconductor die and the substrate, and the semiconductor die can be disposed between the conductive clip and the leadframe.

Semiconductor die package and manufacturing method

In a general aspect, an apparatus can include a first substrate operatively coupled with a second substrate. The apparatus can also include a power supply terminal assembly including a first power supply terminal aligned along a first plane, the first power supply terminal being electrically coupled with the first substrate. The power supply terminal assembly can also include a second power supply terminal aligned along a second plane, the second power supply terminal being electrically coupled with the second substrate. The power supply terminal assembly can further include a power supply terminal frame having an isolation portion disposed between the first power supply terminal and the second power supply terminal and a retention portion disposed around a portion of the first power supply terminal and disposed around a portion of the second power supply terminal.

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Seoul, South Korea

Joonseo Son