Applied Materials, Inc.

Joonho An

Rajeev Bajaj

Jason Garcheung Fung

Mayu Felicia Yamamura

Aniruddh Jagdish Khanna

Veera Raghava Reddy Kakireddy

Puneet Narendra Jawali

Nandan Baradanahalli Kenchappa

Adam Wade Manzonie

Jaeseok Kim

Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.

Polishing pads having selectively arranged porosity

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Pyeongtaek, South Korea

Joonho An