Lg Electronics Inc.

Joonhan Kwon

Bojoong Kim

Hyeyoung Yang

Hyunjung Park

Minpyo Kim

Goohwan Shim

Byungjun Kang

Daeseon Hyun

A solar cell module includes solar cells each including a semiconductor substrate and first and second electrodes that extend in a first direction on a surface of the semiconductor substrate and have different polarities; conductive lines extended in a second direction crossing the first direction on the surface of the semiconductor substrate included in each solar cell and connected to the first electrodes or the second electrodes through a conductive adhesive; and an insulating adhesive portion extending in the first direction on at least a portion of the surface of the semiconductor substrate, on which the conductive lines are disposed, and temporarily fixing the conductive lines to the semiconductor substrate and the first and second electrodes, the insulating adhesive portion being attached on a back surface of least a portion of each conductive line as well as a side surface of at least a portion of each conductive line.

Solar cell module

A solar cell module includes a plurality of cell strings having a plurality of solar cells, each solar cell having a semiconductor substrate, and a first conductivity-type electrode and a second conductivity-type electrode provided on a first surface of the semiconductor substrate, an interconnector electrically connecting a first conductivity-type electrode of a first solar cell, among the plurality of solar cells included in the plurality of cell strings, and a second conductivity-type electrode of a second solar cell adjacent to the first solar cell in a first direction, to connect the first and second solar cells in series, and a first shield positioned on a front surface of the interconnector between the first and second solar cells, and extending in a second direction crossing the first direction.

A solar cell module and a method for manufacturing the same are disclosed. The solar cell module includes solar cells each including a semiconductor substrate, and first electrodes and second electrodes extending in a first direction on a surface of the semiconductor substrate, conductive lines extended in a second direction crossing the first direction on the surface of the semiconductor substrate and connected to the first electrodes or the second electrodes through a conductive adhesive, and an insulating adhesive portion extending in the first direction on at least a portion of the surface of the semiconductor substrate, on which the conductive lines are disposed, and fixing the conductive lines to the semiconductor substrate and the first and second electrodes. The insulating adhesive portion is attached up to an upper part and a side of at least a portion of each conductive line.

Growing community of inventors

Seoul, South Korea

Joonhan Kwon