Samsung Display Co., Ltd.

Joongmok Lee

Chung-Seok Lee

Hanho Park

Soyeon Joo

Jeongeun Park

Jeongmin Ban

Seoungbum Pyoun

Chungseok Lee

Eunjeong Jeon

A film cutting device includes a stage which supports a circuit film, a cutter disposed on the stage to cut the circuit film, a vibration horn connected to the cutter, where the vibration horn vibrates the cutter in a first direction based on an ultrasonic wave, and a cooler which cools the cutter.

Film cutting device, film cutting method using the same, and display device including circuit film cut by the same

An apparatus for manufacturing a display device, includes: a stage; a temperature controlling portion on the stage, and to receive a member seated on the temperature controlling portion; and a jig portion facing the temperature controlling portion, the jig portion to move linearly, and to receive an adhesive member. The jig portion includes: a first support plate; a second support plate facing the first support plate; and a pressurization plate on the first support plate and the second support plate, the pressurization plate to receive the adhesive member thereon. An end of the pressurization plate is spaced further from the member than an end of the first support plate and an end of the second support plate when the member is seated on the temperature controlling portion.

Method for measuring force of adhesive member for manufacturing display device

Provided is a display apparatus. The display apparatus includes a flexible circuit board including flexible pads, a main circuit board including main pads, and a display panel including a plurality of pixels connected to the flexible circuit board and configured to receive a signal from the driving chip. In each of the flexible pads and the main pads, a portion of the pads is gradually tilted from pads disposed at a center to pads disposed at an outer side among the pads, and a tilted angle of a main pad disposed at the outermost side of the main circuit board is greater than that of a flexible pad disposed at the outermost side of the flexible circuit board.

Display apparatus

A display device includes a display panel including a plurality of display pads at least some of which at least a portion extend in a first direction and are arranged in a second direction intersecting the first direction, and a flexible circuit board including circuit pads, at least some of which at are electrically connected to the display pads, and circuit lines connected to the circuit pads. The circuit pads include at least one dummy pad, and the circuit lines include a dummy circuit line, of which at least a portion of is connected to the at least one dummy pad. The dummy circuit line includes a first portion connected to the at least one dummy pad and a second portion spaced apart from the first portion by a gap.

Display device and method for manufacturing the same

A flexible circuit film bonding apparatus includes: a stage configured to support a TFT substrate; a pressing head configured to press and heat a flexible circuit film attached on the TFT substrate with an anisotropic conductive film interposed therebetween; a backup plate configured to support and heat the TFT substrate positioned below the flexible circuit film; and a heating control unit configured to control a temperature of a lower surface of the pressing head and an upper surface of the backup plate, wherein the temperature of the upper surface of the backup plate is less than 170 degrees Celsius.

Growing community of inventors

Gunsan-si, South Korea

Joongmok Lee