Samsung Electronics Co., Ltd.

Joongha Lee

Sangha Park

Junhyung Kim

Sunghyup Kim

Akihiro Komatsu

Takahiro Tokumiya

Tatsuya Ishimoto

YoungBum Kim

Kyeongbin Lim

A pressure heating apparatus that uniformly heats an object in a chamber in a short time includes a stage onto which the object is loaded; a heating light source that faces the stage, where the heating light source heats the object a non-contact manner while irradiating light onto the object; and a lower reflector disposed around the stage and that reflects light emitted from the heating light source toward the object.

Pressure heating apparatus

A chip bonding apparatus includes: a bonding contact configured to apply a bonding force to a semiconductor chip disposed on a substrate, the bonding contact having a first surface configured to face the semiconductor chip and a second surface opposite the first surface, the bonding contact including a protruding portion on the first surface, the protruding portion configured to contact the semiconductor chip, the bonding contact including a cavity formed in a region vertically overlapping the protruding portion, a heater disposed to be in contact with the second surface of the bonding contact to cover the cavity, and configured to heat the bonding contact, a bonding head disposed above the heater and configured to transmit the bonding force, and a partition wall structure protruding from a bottom surface of the cavity to partition an inner space of the cavity.

Chip bonding apparatus and method of manufacturing semiconductor device using the apparatus

Growing community of inventors

Suwon-si, South Korea

Joongha Lee