Samsung Electro-mechanics Co., Ltd.

Joong Won Park

Soon Kwang Kwon

Young Seuck Yoo

Il Jin Park

Jung Wook Seo

Jun Sung Lee

Se Hyung Lee

Ji Hwan Shin

Gwang Hwan Hwang

Jung Ho Cho

Seok Hee Lee

A coil electronic component includes a body including a coil portion therein, and including a plurality of magnetic particles including an Fe-based alloy component, and an external electrode connected to the coil portion, wherein at least a portion of the plurality of magnetic particles include a first layer formed on a surface, and a second layer formed on a surface of the first layer, wherein the first layer includes an Fe oxide component and has a thickness of 10 nm or less.

Coil electronic component

A coil electronic component includes a body including magnetic particles and an insulating resin, and a coil portion disposed within the body. The body has a multilayer structure including a core portion covering the coil portion and a cover portion covering the core portion. The magnetic particles included in the core portion have a distribution of a particle size having a Dof 3.5 &#x3bc;m or less.

A magnetic powder contains a magnetic metal particle comprising iron (Fe) and an insulating coating layer disposed on a surface of the magnetic metal particle and comprising tin (Sn), phosphorous (P) and oxygen (O), and a coil component contains such a magnetic powder.

Magnetic powder and coil component comprising the same

A coil component includes a body having a winding type coil and a core in which the winding type coil is embedded, and external electrodes disposed on external surfaces of the body. The core includes first and second cores, and the first and second cores are coupled to each other with a bonding surface interposed therebetween. The bonding surface is formed of a same type of resin as the first and second cores. The first and second cores each include a resin directly covering surfaces of magnetic powder particles, such that adjacent particles are separated only by the resin. A method of manufacturing the coil component includes applying a solvent to dissolve a resin on a bonding surface of the first core, and mounting the second core to the bonding surface having the solvent applied thereto.

Coil component

A coil electronic component includes a body, a coil unit disposed in the body and having a multilayer structure. The coil unit includes a first coil pattern forming an upward turn with respect to a bottom surface of the body and a second coil pattern forming a downward turn with respect to the bottom surface of the body. The first and second coil patterns are disposed on at least two layers of the multilayer structure. The component additionally includes a first external electrode and a second external electrode disposed on the bottom surface of the body.

A coil electronic component includes a body including ferrite, a coil portion embedded in the body, external electrodes electrically connected to the coil portion, and a magnetic permeability adjusting layer disposed in the body and including ferrite having a Curie temperature lower than that of the ferrite included in the body.

Growing community of inventors

Suwon-si, South Korea

Joong Won Park