Samsung Electro-Mechanics Co., Ltd.

Other

Joong Jin Nam

Youn Suk Kim

Ki Joong Kim

Jun Goo Won

Jae Hyouck Choi

Sang Hee Kim

Jeong Hoon Kim

Kwang Du Lee

Young Jean Song

Kyu Jin Choi

Young Kyoon Im

Suk Chan Kang

Hyo Gun Bae

Shinichi Iizuka

Kyu Bum Han

Ho Kwon Yoon

Kyung Pyo Hong

Chul Hwan Yoon

Jae Soon Lee

Sung Yong An

Ju Young Park

Jae Yeong Kim

Sang Hoon Ha

Kyung Hee Hong

Hyo Keun Bae

Hyo Kun Bae

Seong Geon Kim

Shinichi Ilzuka

A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

Radio frequency filter and radio frequency module

A chip antenna is provided. The chip antenna includes a first dielectric layer; a second dielectric layer disposed on an upper surface of the first dielectric layer; a patch antenna pattern disposed in the second dielectric layer; first and second feed vias disposed to penetrate through at least one of the first and second dielectric layers, respectively and electrically connected to a corresponding feed point among different first and second feed points of the patch antenna pattern; and first and second filters disposed between the first and second dielectric layers, respectively and electrically connected to a corresponding feed via among the first and second feed vias.

Chip antenna and antenna module including chip antenna

A radio frequency filter module includes: an antenna package including patch antennas and having first and second frequency passbands different from each other; an integrated circuit (IC) package including an IC; and a connecting member disposed between the antenna package and the IC package, and having a laminated structure configured to electrically connect the patch antennas and the IC to each other. The connecting member includes: a first radio frequency filter pattern having the first and second frequency passbands, and including a first port electrically connected to the IC and a second port electrically connected to at least one of the patch antennas; and a second radio frequency filter pattern having the first and second frequency passbands, and including a third port electrically connected to the IC and a fourth port electrically connected to at least another one of the patch antennas.

Radio frequency filter module

A radio frequency filter apparatus includes: radio frequency filters each having a first ring-type pattern extended from a respective first port and a second ring-type pattern extended from a respective second port; a cover ground layer disposed on or below the radio frequency filters and disposed to cover at least a portion of each of the radio frequency filters; and a surrounding ground layer disposed to surround at least a portion of each of the radio frequency filters along outer boundaries of the radio frequency filters, wherein the surrounding ground layer is spaced apart from radio frequency filters such that a shortest distance between the radio frequency filters and the surrounding ground layer is 8/5 or more times a shortest distance between the radio frequency filters and the cover ground layer.

Radio frequency filter apparatus and radio frequency module

A power amplifier may include a first amplifying circuit configured to amplify an input RF signal; a second amplifying circuit connected to the first amplifying circuit in parallel configured to amplify the input RF signal; and a controller connected to at least one of the first amplifying circuit and the second amplifying circuit and configured to output a control signal in order to control an on-off state of at least one of the first amplifying circuit and the second amplifying circuit. Such an approach provides high efficiency without adding significant complexity to the power amplifier.

Power amplifier and method of controlling output of power amplifier

A power amplifier may include a first amplifying unit receiving a first bias signal to amplify a power level of an input signal; an envelope detecting unit detecting an envelope of the input signal; a comparing circuit unit comparing a peak value of the detected envelope with a preset reference voltage; and a second amplifying unit amplifying the power level of the input signal according to a second bias signal set depending on a comparison result of the comparing circuit unit.

Power amplifier

A switching circuit may include: the switching circuit includes a switching circuit unit including a first transistor and a second transistor connected to each other in series, the second transistor receiving a first control signal through a control terminal thereof, and an inverter connected between a control terminal of the first transistor and a first terminal of the first transistor. The inverter receives a second control signal and maintains a gate-source voltage level of the first transistor to a threshold voltage level of the first transistor or less, and levels of the first and second control signals are logically complementary to each other.

Switching circuit and RF switch including the same

A transformer having a structure in which first and second substrates are vertically laminated, including: a plurality of input conductive lines disposed on the first substrate along a circumference thereof; a single output conductive line disposed co-planarly with the plurality of input conductive lines, and having one end connected to a ground; and an air bridge including a pair of conductive via holes formed in any one conductive line in an overlapped area in which the input and output conductive lines are intersected with each other to penetrate through the first substrate and a single piece of conductive line connecting the pair of conductive via holes to each other and disposed on the second substrate, thereby preventing a short-circuit between the input and output conductive lines.

Transformer

There is provided a power amplifier circuit capable of improving cross isolation between a high frequency band power coupler and a low frequency band power coupler, by directly transmitting power to the high frequency band power coupler and the low frequency band power coupler from a power amplifier, and forming a predetermined inductance circuit or an LC resonance circuit in a line transmitting the power to the high frequency band power coupler. The power amplifier circuit may include a power amplifying unit supplied with power from the outside and amplifying an input signal, a coupling unit having a high frequency band power coupler and a low frequency band power coupler, and an isolation unit including a first power line and a second power line, wherein the first power line has an inductor blocking signal interference generated in a predetermined frequency band.

Power amplifier circuit

A CMOS power amplifier includes: a first MOS transistor connected between a first power terminal and a first output stage and having a gate connected to an input stage; a second MOS transistor connected between the first output stage and a ground and having a gate connected to the input stage; a switching circuit unit connecting or separating a feedback line between the input stage and the first output stage to select a linear amplifying operation or a non-linear amplifying operation; and a resistor formed at the feedback line between the input stage and the first output stage to determine a linear amplification gain when the feedback line is turned on.

CMOS power amplifier

A transformer includes at least one input conductive line having both ends provided as input ports of a positive (+) signal and a negative (&#x2212;) signal, respectively, one output conductive line disposed adjacent to the at least one input conductive line to be electromagnetically coupled to the at least one input conductive line, and having a first end connected to a ground, a first resonator disposed between a second end of the output conductive line and the ground, a second resonator having a first end connected to the second end of the output conductive line and a second end provided as an output port, and a third resonator connected in series between the first end of the output conductive line and the ground.

Transformer capable of removing harmonic components

A power amplifier includes an inverter amplification section configured to amplify AC components and remove DC components from at least one input signal, an impedance matching section configured to match an impedance of a transmission path of the at least one input signal amplified by the inverter amplification section, and an amplification section configured to amplify an impedance-matched signal from the impedance matching section according to a predetermined gain. The inverter amplification section includes at least one P-channel metal-oxide semiconductor field effect transistor (MOS FET) having a gate configured to receive the at least one input signal and at least one N-channel MOS FET having a gate configured to receive the at least one input signal. The at least one P-channel MOS FET and the at least one N-channel MOS FET are serially connected.

A Tx module includes a plurality of power amplification units, a plurality of matching circuit units configured as transformers having input ports connected to output ports of the plurality of power amplification units, respectively, and a plurality of harmonic filter units having input ports connected to output ports of the plurality of matching circuit units, respectively. At least one of the matching circuit units includes a plurality of primary windings connected to output ports of corresponding power amplifiers of the power amplification units and a secondary winding inductively coupled in common to the plurality of primary windings.

Tx module for wireless communication

Disclosed herein is a power amplifier. The power amplifier includes N power amplification means, a transformer, and a harmonic elimination unit. Each of the N power amplification means amplifies an input signal into a predetermined level. The transformer includes N/2 primary windings respectively connected to the output terminals of the power amplification means and a secondary winding configured such that coil elements are connected in series between an output terminal and a ground, and sums power transmitted from the primary windings. The harmonic elimination unit is disposed across both ends of the secondary winding of the transformer, and eliminates the output of the harmonic frequencies of a preset frequency.

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Seoul, South Korea

Joong Jin Nam