Samsung Electronics Co., Ltd.

Stanzione & Kim, Llp

Joong-Hyun Baek

Sang-Wook Park

Hee-jin Lee

Hae-Hyung Lee

Jin-Yang Lee

Sun-Won Kang

Min-ha Kim

Yun-Hyeok Im

Hee-Jin Lee

Ho-Jeong Moon

Dong-Kil Shin

Yun-hyeok Im

Tae-koo Lee

Jae-Young Kim

Dong-ho Lee

Chul Won Park

Kil-soo Kim

Hyung-gil Baek

Jin-Kwon Bae

Eun-Seok Cho

Sung-jun Im

Hee-Kook Choi

Seong-Jae Hong

Moon-Jung Kim

Yoon-Hoon Kim

Hyung-Gil Baek

Jin-yang Lee

Provided is a nucleic acid amplifying apparatus having a uniform distribution of reaction temperature in a reaction space. The nucleic acid amplifying apparatus includes a substrate providing a polymerase chain reaction (PCR) space, and a plurality of heating units disposed above or below the reaction space to transfer heat to the reaction space, wherein the heating unit includes a plurality of heating units arranged substantially in parallel with each other, and among the plurality of heating units, the heating units disposed adjacent outermost portions of the reaction space have the largest heat radiation quantity.

Apparatus for amplifying nucleic acids

Provided is a package on package (POP) having improved thermal and electric signal transmitting characteristics. The POP may include a first semiconductor package, a second semiconductor package larger than the first semiconductor package and mounted on the first semiconductor package, and a heat slug adhered to a bottom of a second substrate of the second semiconductor package and surrounding a side of the first semiconductor package. The heat slug may be a capacitor.

Package on package having improved thermal characteristics

A semiconductor package includes a semiconductor chip stack disposed between first and second leads near first and second sides of the package and including a plurality of semiconductor chips, and a redistribution structure disposed on the semiconductor chip stack. At least one semiconductor chip of the semiconductor chip stack includes a plurality of first chip pads disposed near or closer to a third side of the package. The redistribution structure includes a first redistribution pad disposed near or closer to the first side and electrically connected to the first lead, a second redistribution pad disposed near or closer to the second side and electrically connected to the second lead, and a third redistribution pad disposed near or closer to the third side and electrically connected to a first one of the first chip pads and the first redistribution pad.

Integrated circuit packages having redistribution structures

Provided are a semiconductor package of a semiconductor chip, a semiconductor module, an electronic system, and methods of manufacturing the same. The method includes mounting a semiconductor chip on a package substrate, forming a molding member on the semiconductor chip, forming via holes penetrating the molding member to expose a portion of a top surface of the semiconductor chip, the via holes being arranged in a lattice shape in a plan view, and forming thermally conductive via plugs in the via holes.

Method of manufacturing semiconductor package

A three-dimensional semiconductor module and an electronic system including the same are provided. The semiconductor module includes a module substrate, a logic device formed on a part of the module substrate, and a plurality of memory devices formed on another part of the module substrate, wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter. The electronic system includes the semiconductor module.

Semiconductor module and an electronic system including the same

A light emitting device with improved heat dissipation is provided. The light emitting device includes a first lead frame, a second lead frame, a light emitting element and a housing. The first lead frame includes a light emitting element mounting portion, a first heat dissipation portion extending from the light emitting element mounting portion in a first direction, and second and third heat dissipation portions extending from the light emitting element mounting portion in a second direction opposite to the first direction. The second lead frame extends in the second direction and is disposed between and spaced apart from the second and third heat dissipation portions. The light emitting element is mounted on the light emitting element mounting portion and is electrically coupled to the first and second lead frames. The housing encapsulates the first and second lead frames. The second and third heat dissipation portions have a first width and the second lead frame has a second width the same as or different from the first width.

Light emitting device

A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.

Wafer stacked package waving bertical heat emission path and method of fabricating the same

A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

Semiconductor module

An integrated circuit package may include a board that may support an integrated circuit chip. A post pin may be provided on a surface of the board. The post pin may be electrically connected to the integrated circuit chip. A land pin may be provided on the other surface of the board. The land pin may be electrically connected to the integrated circuit chip.

Integrated circuit package and integrated circuit module

Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.

Semiconductor memory module having an oblique memory chip

A semiconductor device capable of improving the efficiency of dispersing heat via a dummy pad. The semiconductor device may be included in a semiconductor package, stack module, card, or system. Also disclosed is a method of manufacturing the semiconductor device. In the semiconductor device, a semiconductor substrate has a first surface and a second surface opposite to the first surface, and at least one conductive pad is arranged on a predetermined region of the first surface. At least one dummy pad is arranged on the first or second surface, and is not electrically coupled to the at least one conductive pad. The dummy pad or pads may be used to disperse heat. Accordingly, it is possible to increase the efficiency of dispersing heat of a semiconductor device, thereby improving the yield of semiconductor devices.

Semiconductor device including thermally dissipating dummy pads

A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and a coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.

Wafer stacked package having vertical heat emission path and method of fabricating the same

In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.

Memory module, socket and mounting method providing improved heat dissipating characteristics

A semiconductor stack package includes lower and upper individual packages. When the upper individual package is stacked on the lower individual package, a heat-conducting layer provided under the upper package touches a heat-mediating layer provided on the lower package. Thus, a layer of trapped air found in conventional stack packages is eliminated, and a direct heat-dissipating path is produced through both the heat-conducting layer and the heat-mediating layer. Therefore, the heat dissipation of the stack package is improved. Alternatively, the stack package may have a symmetric configuration in which each IC chip faces away from each other. A memory module has several stack packages mounted on one or both surfaces of a module board. The method includes forming the packages and stacking the packages. The method further includes forming a module board and mounting the stack packages on the module board.

Growing community of inventors

Suwon-si, South Korea

Joong-Hyun Baek