Intel Corporation

Joong-Ho Kim

Dong-Ho Han

Hyunjun Kim

Jiangqi He

Ping Sun

Jianggi He

Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.

Integrated circuit package with chip-side signal connections

Transmission line impedance matching for matching an impedance discontinuity on a transmission signal trace with one or more non-transmission traces disposed near the transmission signal trace at a region corresponding to the impedance discontinuity.

Transmission line impedance matching

An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates include a plurality of terminals coupled to a bottom side of the plates.

Vertical capacitor apparatus, systems, and methods

Transmission line impedance matching is described for matching an impedance discontinuity on a transmission signal trace. The apparatus includes a transmission signal trace and a non-transmission trace. The transmission signal trace has an impedance discontinuity, a first length, and a predetermined first width. The non-transmission trace is disposed near the transmission signal trace at a region corresponding to the impedance discontinuity. The non-transmission trace has a second length that is substantially less than the first length of the transmission signal trace. Additionally, the non-transmission trace is configured to be electromagnetically coupled to the transmission signal trace in the presence of a current on the transmission signal trace to provide a matched impedance on the transmission signal trace.

An apparatus comprises a signal layer including a first and second signal trace. The apparatus also comprises a first reference plane including a first slot substantially parallel to the first and second signal traces. Further, the apparatus includes a dielectric layer having at least a portion disposed between the signal layer and the first reference plane.

Reference slots for signal traces

A socket electrically connects an integrated circuit package and a circuit board. The socket includes a frames having a plurality of electrical connectors mounted to the frame. The plurality of electrical connectors includes at least one pair of power and ground connectors, with power connector including a first broadside portion and the ground connector including a second broadside portion. The first and second broadside portion are disposed in an adjacent, spaced-apart, and substantially parallel relationship.

Growing community of inventors

Phoenix, AZ, United States of America

Joong-Ho Kim