Gct Semiconductor, Inc.

Anapass Inc.

Gct Research, Inc.

Joonbae Park

Kyeongho Lee

Jeong-Woo Lee

Yido Koo

Seung-wook Lee

Eunseok Song

Jeong Woo Lee

Kang Yoon Lee

Eal Wan Lee

Hyungki Huh

Deog-Kyoon Jeong

Wonchan Kim

Jeongwoo Lee

Youngho Ahn

Kang-yoon Lee

Won-Seok Lee

Suwon Kang

Hoe-Sam Jeong

In Ho Song

Su Won Kang

Deok Hee Lee

Hei-sam Jeong

Young-Deuk Jeon

Seung-Wook Lee

Sang Hun Jung

Hei-Sam Jeong

Kyeongho 309-901 Sam-Sung-San-Ju-Kong Apt Lee

Deog-Kyoon 301-803 School Of Elec Eng Jeong

Embodiments according to the application relates to an OFDM (orthogonal frequency division multiplexing) receiving circuit and methods thereof configured to have a plurality of demodulation paths for an oversampling ADC, which can increase or improve an overall performance of the circuit.

OFDM receiving circuit having multiple demodulation paths using oversampling analog-to-digital converter

The present invention relates to an apparatus and a method for measuring an in phase and quadrature (IQ) imbalance. One embodiment according to the present general inventive concept can provide a method for measuring a Tx IQ imbalance generated in an IQ up-conversion mixer and an Rx IQ imbalance generated in an IQ down-conversion mixer, that includes measuring a first IQ imbalance corresponding to a first combination of the Rx IQ imbalance with the Tx IQ imbalance, measuring a second IQ imbalance corresponding to a second combination of the Rx IQ imbalance with the Tx IQ imbalance and obtaining the Tx IQ imbalance and the Rx IQ imbalance from the first IQ imbalance and the second IQ imbalance.

Apparatus for measuring IQ imbalance

The present general inventive concept relates to apparatuses and/or methods for measuring an in-phase and quadrature (IQ) imbalance. In one embodiment, a detector can measure an error caused by an IQ imbalance using a first IQ signal including a desired signal and a corresponding image signal by the IQ imbalance. The detector can include a derotator to derotate the first IQ signal by a first angular frequency to obtain a second IQ signal and derotate the first IQ signal by a second angular frequency to obtain a third IQ signal, a DC estimator to obtain a fourth IQ signal corresponding to a DC component of the second IQ signal and a fifth IQ signal corresponding to a DC component of the third IQ signal and a controller can determine a gain error or a phase error from the fourth IQ signal and the fifth IQ signal.

Apparatus for measuring in-phase and quadrature (IQ) imbalance

The present general inventive concept relates to apparatuses and/or methods for measuring an in-phase and quadrature (IQ) imbalance. In one embodiment, a signal generator can provide a first IQ signal of a DC component during a first period and the first IQ signal of a first angular frequency during a second period, an IQ up-conversion mixer can up-convert the first IQ signal by a second angular frequency during the first period and up-convert the first IQ signal by a third angular frequency during the second period to output a second IQ signal, an IQ down-conversion mixer can down-convert the second IQ signal by the third angular frequency to output a third IQ signal and an IQ imbalance detector can obtain a first IQ imbalance (e.g., Rx IQ imbalance) from the third IQ signal during the first period and a second IQ imbalance (e.g., Tx/Rx IQ imbalance) during the second period.

An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization.

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

The application discloses embodiments of methods and/or systems for compensating a transmission carrier leakage of an up-conversion mixer, a tranceiving circuit or apparatus embodying the same. One embodiment of a method can include detecting an I channel DC offset DCIand a Q channel DC offset DCQgenerated by a reception carrier leakage from an output of a down-conversion mixer, detecting an I channel DC offset DCI and a Q channel DC offset DCQ from the output of the down-conversion mixer while varying a compensation parameter being inputted to an up-conversion mixer that has its output coupled to an input of the down-conversion mixer to determine the compensation parameter that can reduce or minimize a transmission carrier leakage. A combination of a transmission baseband signal and the determined compensation parameter can be transmitted using the up-conversion mixer and an antenna to compensate for the transmission carrier leakage.

Method for compensating transmission carrier leakage and transceiving circuit embodying the same

Embodiments of an RFIC and methods for same and mobile terminals can internally reduce an input voltage to provide a prescribed voltage to a radio frequency transceiver. Embodiments of an RFIC can have a high efficiency and/or a low noise. In one embodiment, a device can include a PMIC and an RFIC. The RFIC can include an RF transceiver to carry out an RF transmission and an RF reception, a DC-DC converter to lower a voltage provided by the PMIC, and an LDO regulator to regulate the lowered voltage to a fixed voltage used by the RF transceiver.

Radio frequency integrated circuit

Embodiments of methods receiving circuits and apparatuses compensate for an IQ mismatch using a test signal positioned in a guard band. One embodiment of a method can include converting a sum of a received signal and a test signal positioned in a guard band to a first signal and a second signal of an intermediate frequency or a base band using an IQ mixer, detecting the IQ mismatch using the test signal respectively included in subsequent signals corresponding to the first signal and the second signal and compensating for the detected IQ mismatch using the IQ mismatch.

Receiving circuit and method for compensating IQ mismatch

Embodiments of methods, transceiver circuits, and systems can compensate an IQ mismatch (e.g., Tx or Rx) or a carrier leakage using a plurality of local oscillators. One embodiment of a transceiver can include a first up-conversion IQ mixer, a second up-conversion IQ mixer, a first down-conversion IQ mixer with an input to receive an output of the second up-conversion IQ mixer, a second down-conversion IQ mixer with an input to receive an output of the first up-conversion IQ mixer, a first local oscillator to generate a first IQ LO signal for the first up-conversion IQ mixer and the first down-conversion IQ mixer, and a second local oscillator to generate a second IQ LO signal for the second up-conversion IQ mixer and the second down-conversion IQ mixer.

Tranceiver circuit for compensating IQ mismatch and carrier leakage and method for controlling the same

Embodiments of the present general inventive concept include a low noise amplifier and method with an improved linearity while reducing a noise disadvantage (e.g., increase). One embodiment of a low noise amplifier can include a first transistor to receive an input signal at a control terminal thereof, a second transistor having a first terminal coupled to a second terminal of the first transistor, an envelope detector to output a control signal corresponding to a characteristic of the input signal and an envelope amplifier to amplify the control signal to be applied to a control terminal of the second transistor.

Low noise amplifier having improved linearity

An integrated circuit package includes an inductance loop formed from a connection of lead wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from first and second wires which connect a first bonding pad on the integrated circuit chip to a first I/O pin of the package and a third and fourth wires which connect a second bonding pad on the chip to a second I/O pin of the package. To complete the inductor loop, the first and second I/O pins are connected by a third conductor between the pins. The third conductor may include one or more bonding wires and the I/O pins are preferably ones which are adjacent one another. However, the loop may be formed from non-adjacent connections of I/O pins based, for example, on loop-length requirements, space considerations, and/or other design or functional factors. In another embodiment, connection between the first and second I/O pins is established by making the I/O pins have a unitary construction. In another embodiment, connection between the first and second I/O pins is established by a metallization layer located either on the surface of the package substrate or within this substrate. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization. Also, the integrated circuit may be implemented in any one of a variety of systems, at least one parameter of which is controlled by the length of the inductor loop of the package.

Integrated circuit package having an inductance loop formed from a multi-loop configuration

The application discloses system and method embodiments related to a frequency synthesizer. Embodiments of a frequency synthesizer can have a low phase noise and a narrow channel spacing. Embodiments of a frequency synthesizer can use two phase locked loops. One embodiment of a frequency synthesizer can include a reference frequency oscillator for outputting a signal having a reference frequency, an integer-N phase locked loop to generate a first output frequency signal based on the reference frequency signal, a fractional-N phase locked loop to generate a second output frequency based on the reference frequency signal and a circuit to generate an output frequency signal by combining the first output frequency and the second output frequency.

Frequency synthesizer using two phase locked loops

A sigma-delta based phase lock loop device is provided that includes a phase frequency detector (PFD), a charge pump and a voltage controlled oscillator. The PFD to receive a reference signal and a feedback signal and to output signals based on a comparison of the reference signal and the feedback signal. The charge pump to output a charge based on the output signals from the PFD. The charge pump including a first current source to apply a fixed amount of current and a second current source to apply a variable amount of current. The voltage controlled oscillator to output a clock signal based on the received charge from the charge pump.

Sigma-delta based phase lock loop

Embodiments of methods and apparatuses can compensate gain ripple and/or group delay characteristics of at least one filter, a receiving circuit embodying a filter, or a communication system having a wireless terminal embodying the receiving circuit.

Method for compensating for gain ripple and group delay characteristics of filter and receiving circuit embodying the same

An LC-VCO includes a multivibrator which outputs a frequency signal, a fine tuning circuit which tunes the frequency signal by a first amount, a coarse tuning circuit which tunes the frequency signal by a second amount, and a control circuit which controls the fine and coarse tuning circuits. The coarse tuning circuit is formed from one or more capacitive arrays and the fine tuning circuit is formed from one or more varactors. The capacitive arrays are preferably controlled by a digital signal, where each bit selectively couples a respective capacitor to the multivibrator. An analog signal controls the value of the varactors. The capacitive arrays and varactors charge and discharge an inducator in the multivibrator to tune the frequency signal. The VCO may be incorporated within a phase-locked loop, where the capacitors may be assigned different weight and/or redundancy values to tune an output frequency signal. In one embodiment, coarse tuning and lead-lag detection is performed more accurately to allow the size of the varactors to become significantly reduced compared with other circuits which have been proposed.

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Seoul, South Korea

Joonbae Park