Samsung Electronics Co., Ltd.

Lg Electronics Inc.

Samsung Electro-mechanics Co., Ltd.

Osong Medical Innovation Foundation, Korea University Research and Business Foundation

Joon Seok Oh

Changbo Lee

Kwanhoo Son

Dae Hee Lee

Joo Hyung Lee

Byung Lyul Park

Ki Tae Park

Do Young Jeong

Bong Soo Kim

Jeong Ho Yeo

Tae Ho Ko

Chang Bo Lee

Hyun Chul Jung

Myeong Ho Hong

Joonho Lee

Jong Ho Yun

Disclosed are semiconductor devices and methods of fabricating the same. The method comprises providing a carrier substrate that includes a conductive layer, placing a semiconductor die on the carrier substrate, forming an insulating layer to cover the semiconductor die on the carrier substrate, forming a via hole to penetrate the insulating layer at a side of the semiconductor die and to expose the conductive layer of the carrier substrate, performing a plating process in which the conductive layer of the carrier substrate is used as a seed to form a via filling the via hole, forming a first redistribution layer on a first surface of the semiconductor die and the insulating layer, removing the carrier substrate, and forming a second redistribution layer on a second surface of the semiconductor die and the insulating layer, the first surface and the second surface being located opposite each other.

Semiconductor device and method of fabricating the same

A semiconductor package includes an insulating layer including a first face and a second face opposite each other, a redistribution pattern including a wiring region and a via region in the insulating layer, the wiring region being on the via region, and a first semiconductor chip connected to the redistribution pattern. The first semiconductor chip may be on the redistribution pattern. An upper face of the wiring region may be coplanar with the first face of the insulating layer.

Semiconductor package

This invention relates to magnetite-based sintered iron ore wherein a magnetite ore powder, which is not currently utilized owing to its low reducibility index among iron ore materials serving as a main material in iron-making processes, is improved so as to have a high reducibility index, and to a method of manufacturing the same.

Magnetite-based sintered ore and method of producing same

A fan-out semiconductor package includes a first connection member having a through-hole first and second semiconductor chips disposed in the through-hole, an encapsulant encapsulating the first and second semiconductor chips, a second connection member disposed on at least one side of the first and second semiconductor chips and including a redistribution layer electrically connected to the first and second semiconductor chips, and an insulating via in which at least a portion of the first connection member is removed in a thickness direction and is filled with an insulating material.

Fan-out semiconductor package

A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, a first encapsulant encapsulating at least portions of the first connection member and the semiconductor chip, a second connection member disposed on the first connection member and the semiconductor chip. The first connection member and the second connection member respectively include redistribution layers electrically connected to the connection pads of the semiconductor chip. The fan-out semiconductor package may have excellent rigidity, may be thinned, and may be manufactured in a simplified process.

A communication terminal, computer program product and method thereof by which an image set for a phone number can be provided using a plurality of partial images in inputting a phone number to which a call signal will be transmitted. Also, a display for displaying information, a user input unit for inputting a plurality of digits configuring a phone number, and a controller for controlling the display to complete an image including at least one or more partial images by sequentially displaying the at least one or more partial images, when a plurality of the digits are inputted via the user input unit.

Communication terminal and displaying method thereof

Growing community of inventors

Seoul, South Korea

Joon Seok Oh