Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Joon Seok Chae

Kwang Soo Kim

Young Ki Lee

Chang Seob Hong

Bum Seok Suh

Tae Hoon Kim

Seog Moon Choi

Suk Ho Lee

Do Jae Yoo

Kee Ju Um

Young Hoon Kwak

Yong Il Kwon

Tah Joon Park

Sun Woo Yun

Chang Hyun Lim

Yun Tae Lee

Jae Chan Lee

Young Su Kwak

Sung Keun Park

Yong Woon Park

Jong Hwan Baek

Jung Eun Kang

Jong Woo Choi

Tae Gyu Ryu

Heung Soo Park

Tae Kon Koo

A sensing device includes a fixed member, a rotation member disposed at both ends of the fixed member, a camera installed on the fixed member, and respective radar units installed on the rotation members, where the respective radar units are configured to sense respective objects at edges of a viewing angle of the camera and respective objects outside of the viewing angle of the camera.

Sensing device

A camera for a vehicle includes: an imaging unit configured to image an exterior of the vehicle; and a controller configured to enlarge a region of interest of the imaging unit in response to a driving speed of the vehicle being higher than a reference speed, and reduce the region of interest of the imaging unit in response to the driving speed being lower than the reference speed.

Camera for vehicle

A vehicle camera system includes: an around view camera device including a front camera, a left camera, a right camera, and a rear camera, and configured to vary a field of view of one or more of the cameras in response to a control signal; and a control device configured to control the field of view by generating the control signal, in response to an operating mode.

System and method with vehicle camera

A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.

Fingerprint sensing device

There is provided a semiconductor module package including: a base substrate formed by mounting one or more first semiconductor devices thereon; a lead frame formed on a top surface of the first semiconductor device and having an inlet formed to inject a solder paste; and spaces inserted between the first semiconductor device and the lead frame to form a separation space, wherein the solder paste is filled in the separation space.

Semiconductor module package and method of manufacturing the same

There is provided a power module package. The power module package includes: a base substrate provided with a pattern; a heat spreader formed by being stacked on an upper surface of the base substrate; and at least one first semiconductor device mounted on an upper surface of the heat spreader, wherein an outer circumferential surface of the heat spreader is provided with a coil.

Power module package including heat spreader and inductance coil

Disclosed herein is a power semiconductor module. The power semiconductor module includes: a printed circuit board (PCB); first and second heat spreaders mounted on the PCB and having one surface arranged with terminal slots; power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the second heat spreader; and first and second terminals provided with protrusion inserted into the terminal slots and provided with connection terminals for connecting external terminals. Therefore, it is possible to improve heat radiating properties of the power semiconductor module and improve a reliability problem such as solder crack or delamination in connection with terminal connection.

Power semiconductor module

There is provided a leadless package type power semiconductor module. According to an exemplary embodiment of the present disclosure, the leadless package type power semiconductor module includes: connection terminals of a surface mounting type (SMT) formed at edges at which respective sides of four surfaces meet each other; a first mounting area connected to the connection terminals through a bridge to be disposed at a central portion thereof and mounted with power devices or control ICs electrically connected to the power devices to control the power devices; and second mounting areas formed between the connection terminals and mounted with the power devices or the control ICs, wherein the first mounting area is disposed at a different height from the second mounting area through the bridge to generate a phase difference from the second mounting area. Therefore, it is possible to implement a high-integration, high-performance, and small power semiconductor module by applying a three-dimensional structure deviating from a one-dimensional flat structure.

Leadless package type power semiconductor module

Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Heat radiating substrate and method of manufacturing the same

Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate.

Power module package with a fastening unit including a non-conductive portion

Disclosed herein is a power module package including an external connection terminal; a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is buried at a predetermined depth in a thickness direction; and a semiconductor chip mounted on one surface of the substrate.

Power module package and method for manufacturing the same

Disclosed herein are a power module package and a method of manufacturing the same. According to a preferred embodiment of the present invention, the power module package includes: a lead frame on which a power device and a control IC electrically connected to the power device and controlling the power device are mounted; and a thermal sheet bonded to one surface of the lead frame, wherein the thermal sheet includes first and second resin layers which include a thermal conductive inorganic filler and are added with a mixture of phenyl glycidyl ether (PGE) and alkyl glycidyl ether (Alkyl (C12 to C14) glycidyl ether), and a thermal spreader of a metal material disposed at a bonded interface which is formed between the first and second resin layers. Therefore, it is possible to easily improve a thermal property of the power module package by a thermal spreading effect due to the thermal spreader.

Power module package and method of manufacturing the same

Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

Method of manufacturing a hybrid heat-radiating substrate

Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Heat radiating substrate and method for manufacturing the same

Provided is an LED light source including a frame having a V-shaped groove formed in the upper portion thereof and a heat sink formed to extend from the lower portion thereof, the V-shaped groove having a planar bottom surface on which a circuit pattern is formed; a plurality of LEDs disposed on the bottom surface of the V-shaped groove; a diffuser plate coupled to the upper end of the frame so as to diffuse light emitted from the plurality of LEDs; a pair of plugs coupled to both side ends of the frame and receiving alternating-current (AC) power from outside; and a power converter fixed and coupled to the lower portion of the frame and electrically connected to the plugs and the plurality of LEDs, the power converter converting the AC power applied from the plugs into direct-current (DC) power and supplying the DC power to the LEDs.

Growing community of inventors

Suwon-si, South Korea

Joon Seok Chae