Samsung Electronics Co., Ltd.

Joon Seo Yim

Yun Tae Lee

Jae Yong Park

Su-Young Lee

Je Suk Lee

Jun-Woo Park

Yong Ju Jung

Chae Sung Kim

Kwang Hyuk Bae

An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.

Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules

A method of enhancing a low-light image includes receiving a first image from an RWB image sensor, receiving a second image from an RGB image sensor, receiving an illumination value from an illumination sensor, and selecting at least one of the first and second images and generating a third image using the at least one selected image.

Low-light image quality enhancement method for image processing device and method of operating image processing system performing the method

Growing community of inventors

Seoul, South Korea

Joon Seo Yim