Samsung Electro-mechanics Co., Ltd.

Joon-Rak Choi

Byung-Ho Jun

Jae-Woo Joung

Kwi-Jong Lee

Young-Il Lee

Dong-hoon Kim

Tae-hoon Kim

Jaewoo Joung

Young-Kwan Seo

The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.

Apparatus and method for manufacturing metal nanoparticles

The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating.

Inkjet ink composition

The present invention relates to a method for manufacturing copper-based nanoparticles, in particular, to a method for manufacturing copper-based nanoparticles, wherein the method includes producing CuO nanoparticles by mixing CuO micropowder and alkylamine in a nonpolar solvent and heating the mixture at 60-300&#xb0; C.; and producing copper-based nanoparticles by mixing a capping molecule and a reducing agent with the CuO nanoparticles and heating the mixture at 60-120&#xb0; C. According to the present invention, copper-based nanoparticles can be synthesized using CuO, but not requiring any inorganic reducing agent, in a high yield and a high concentration, so that it allows mass production and easy controlling to desired oxidation number of nanoparticles.

Method for manufacturing copper-based nanoparticles

The present invention relates to a non-aqueous conductive nanoink composition including 20 to 85 parts by weight of metal nanoparticles which is chosen from silver, copper, nickel, platinum, palladium, and gold; 0.5 to 10 parts by weight of a polymer having an anhydride group; 15 to 80 parts by weight of a non-aqueous organic solvent. The non-aqueous conductive nanoink composition of the present invention prevents cracks during the drying process, increases the adhesion between wiring and substrate, and allows forming conductive wirings and films without cracks and delamination on the substrate such as polymer including polyimide and glass or silicon wafer.

Growing community of inventors

Incheon, South Korea

Joon-Rak Choi