Lg Innotek Co., Ltd.

Ls Cable Ltd.

Ls Mitron Ltd.

Joon-Mo Seo

Byoung-Un Kang

Jae-Hoon Kim

Tae-Hyun Sung

Kyung-Tae Wi

Soon-Young Hyun

Jun-Woo Lee

Byoung-Kwang Lee

Dong-Cheon Shin

Young-Ju Kang

Chan-Young Choi

Goo-Yun Chung

Jeong-Ill Choi

Seong-Hwan Jang

Ju-Hyuk Kim

Jai-Hoon Kim

A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.

Dicing die attachment film and method for packaging semiconductor using same

Disclosed is a squeeze for a screen printer. The present invention provides a squeeze for a screen printer, which coats a printed circuit board with an adhesive paste while moving parallel over a metal mask on the printed circuit board, the printed circuit board being open through an opening of the metal mask, the squeeze including a solvent storage unit for storing solvents; and solvent discharging holes for discharging the solvents, stored in the solvent storage unit, to an adhesive paste. Accordingly, the squeeze for a screen printer of the present invention may be useful to prevent a dog ear phenomenon, namely that an adhesive paste layer is asymmetrically formed in an indented manner, by controlling a viscosity of an adhesive paste by discharging a solvent onto an adhesive paste layer that comes in contact with the squeeze when the adhesive paste layer is formed in the printed circuit board.

Squeeze for screen printer

The present invention relates to a semiconductor packaging method. The method comprises (S) applying a die adhesive to an upper surface of a member through screen-printing; (S) B-stage curing the member having the die adhesive; (S) attaching a die on the B-stage cured die adhesive; (S) wire-bonding the die to the member; and (S) encapsulating the outside of the resultant, after the B-stage curing process of the step S, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step Sis performed such that the die adhesive maintains an adhesive strength of 10 kgf/cmor more at normal temperature after the die attaching.

Semiconductor packaging method

A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.

Dicing die adhesive film for semiconductor

Growing community of inventors

Gyeonggi-do, South Korea

Joon-Mo Seo