Samsung Electronics Co., Ltd.

Joon-Mo Kwon

Dong-Gun Park

Tae Kyung Kim

Jin-Kee Choi

Won Shik Lee

Hyeong-Chan Ko

Hong-Joon Moon

Byung-Jun Park

Yun-Jae Lee

Man-Jong Yu

Myoung-Hee Han

Jong-Wan Ma

Won-Mo Park

Seung-Beom Kim

A semiconductor device includes an interlayer insulating layer on a semiconductor substrate, at least one plug on the semiconductor substrate, the plug extending through the interlayer insulating layer toward an upper portion of the semiconductor substrate, the plug having a lower part with a first diameter and an upper part with a second diameter different from the first diameter, a filling pattern on the interlayer insulating layer, the filling pattern surrounding the upper part of the plug, and an upper surface of the filling pattern being substantially coplanar with an upper surface of the plug, the upper surface of the plug facing away from the semiconductor substrate, and a protection pattern on the upper part of the plug, the protection pattern being between the plug, the filling pattern, and the interlayer insulating layer.

Semiconductor device having a filling pattern around a storage structure and method of forming the same

According to some embodiments, methods of fabricating a complementary metal oxide semiconductor (CMOS) type semiconductor device having dual gates are provided. The method includes forming an insulated first gate electrode on the P-type well, and an insulated second initial gate electrode on the N-type well. A first lower interlayer insulating layer exposing a top surface of the first gate electrode is formed on the P-type well while a second lower interlayer insulating layer exposing a top surface of the second initial gate electrode is formed on the N-type well. P-type impurity ions are selectively implanted into the second initial gate electrode to form a second gate electrode. A first ion implantation mask pattern is formed over the first gate electrode while a second ion implantation mask pattern is formed over the second gate electrode. The second lower interlayer insulating layer is etched, using the second ion implantation mask pattern as an etch mask, to expose a top surface of the N-type well. P-type impurity ions are implanted into the N-type well, using the second ion implantation mask pattern as an ion implantation mask, to form second source and drain regions on both sides of the second gate electrode.

Method of fabricating CMOS type semiconductor device having dual gates

A semiconductor device with a load resistor is manufactured such that a contact is formed at both ends of the load resistor, and at least one contact is formed between the contacts, in order to prevent impurities from being generated within each contact while the contacts are being generated by etching an insulation layer phenomena of electric charge build up from occurring when an etching process fabricates an insulation layer to generate the contact in a long load resistor located under the insulation layer and insulated electrically and physically.

Semiconductor device with load resistor and fabrication method

Disclosed herein is a method of forming a reliable high performance capacitor using an isotropic etching process to optimize the surface area of the lower electrodes while preventing an electrical bridge from forming between the lower electrodes. This method includes multiple sacrificial oxide layers that are formed over a substrate, an insulating layer with contact plugs, and an etch stopping layer. The sacrificial oxide layers are patterned and additionally isotropically etched to form an expanded capacitor hole. An exposed portion of the etch stopping layer is then etched to form a final capacitor hole exposing an upper portion of the contact plug and a portion of the insulating layer adjacent thereto. The semiconductor substrate having the final capacitor hole is cleaned to remove a native oxide film on the exposed upper portion of the contact plug.

Method of forming a reliable high performance capacitor using an isotropic etching process

Load resistor with dummy contact substantially free of charge build up during etching process

Growing community of inventors

Gyeonggi-do, South Korea

Joon-Mo Kwon