Skhynix Inc.

Joon Ki Hong

Tae Yong Lee

Ki Bum Kim

Bok Gyu Min

Da Un Nah

Jae Joon Ahn

A semiconductor package includes: first, second, third and fourth semiconductor chips stacked while having the arrangement of chip selection vias; and a connection unit provided between a second semiconductor chip and a third semiconductor chip, and configured to mutually connect some of the chip selection vias of the second and third semiconductor chips and disconnect the others of the chip selection vias of the second and third semiconductor chips, wherein the first and second semiconductor chips and the third and fourth semiconductor chips are stacked in a flip chip type.

Growing community of inventors

Icheon-si, South Korea

Joon Ki Hong