Samsung Electronics Co., Ltd.

Ls Cable & System Ltd.

Lg Electronics Inc.

Joon Keun Lee

Tae Hyun Kim

Ji Sung Kim

Hyeon J Jeong

Kum Hwan Cha

Jae Cheol Gwag

Weon Bae Kim

Kyoung Ro Ko

Kyung Suk Kim

Su Kil Lee

Jeong Ho Kim

Won Ki Park

Oh-Sik Kwon

Soon Il Sohn

A power cable includes a conductor, an inner semi-conductive layer covering the conductor, an insulating layer covering the inner semi-conductive layer and impregnated with insulating oil, an outer semi-conductive layer covering the insulating layer, a metal sheath layer covering the outer semi-conductive layer, and a cable protection layer covering the metal sheath layer. A minimum thickness t1 of a certain cross section of the metal sheath layer is less than or equal to 90% of a maximum thickness t2 thereof.

Power cable

A power cable includes a conductor; an inner semi-conductive layer covering the conductor; an insulating layer covering the inner semi-conductive layer, the insulating layer being impregnated with an insulating oil; an outer semi-conductive layer covering the insulating layer; a metal sheath layer covering the outer semi-conductive layer; and a cable protection layer covering the metal sheath layer. The insulating layer is formed by cross-winding insulating paper and impregnating the insulating paper with the insulating oil. The inner semi-conductive layer and the outer semi-conductive layer are formed by cross-winding semi-conductive paper and impregnating the semi-conductive paper with the insulating oil. A thickness of the outer semi-conductive layer is 7.5 to 15% of a total thickness of the inner semi-conductive layer, the insulating layer, and the outer semi-conductive layer.

Disclosed is a refrigerator having a noise reduction structure. According to the refrigerator, a branch pipe for reducing the intensive noise occurring from an impeller part is provided to a discharge pipe connected so that the refrigerant is discharged in a direction of a condenser from the impeller part. Therefore, the traveling sound wave of the noise traveling along the discharge pipe and the reverse sound wave traveling toward the branch pipe provided to the outer periphery of the discharge pipe meet each other, so that the both sound waves are cancelled to reduce the noise.

Refrigerator with noise reduction structure using inverse phase sound wave

A lead frame for a semiconductor device used in a vertically surface-mounted package which has internal leads gathered on one side thereof includes separately formed dummy leads attached to a semiconductor chip on the opposite side of the lead frame to avoid an inconsistent inflow pressure of a molding material during a package molding process caused by gathering of the internal leads on only one side, thereby enhancing reliability of the semiconductor package. There is also no need to separately form a heat sink structure for eliminating heat of the semiconductor chip since the dummy leads function as the heat sink.

Lead frame having dummy leads

A semiconductor chip package comprises leads which protrude from one side of a package body, and support portions which are formed at both ends of the package body on either side of the leads for firmly mounting the package on a printed circuit board (PCB). The support portions are made of a same material as the package body. At the package body, a slot is formed to further protect the leads, and the leads are alternately formed to mount the packages close by. Thus, there is no additional process step for forming holes in the PCB to mount the support portions of the semiconductor package, so the mounting process of the package becomes simpler. The support portions which protrude from the package body permit the package to be mounted on the PCB firmly. The slot and support portions protect the leads and prevent the leads from being deformed by external forces, thereby improving the reliability of the semiconductor package. Also, since the leads are alternately formed and the packages can be mounted near to each other, the package occupies only a small area of the PCB, thereby improving the packing density.

High density vertically mounted semiconductor package

A door condition sensing apparatus for a microwave oven includes a mechanical switch and a photodetector, each of which is separately responsive to the closing of the door. A microprocessor receives signals from both the switch and the photo-detector to determine whether the door is closed. The photo-detector is actuated by a lever which is swung by the door as it closes. The lever comprises an actuator arm of a second switch connected to the microprocessor.

Growing community of inventors

Seoul, South Korea

Joon Keun Lee