Lg Chem, Ltd

Electronics and Telecommunications Research Institute

Samsung Electronics Co., Ltd.

Joon Hyung Kim

Mi Lim Yu

Kook Hyun Choi

Yu Jin Woo

Ji Won Kwak

Yung Jong Lee

Se Woo Yang

Suk Ky Chang

Hyun Sik Kim

Kwang Chun Lee

Se Ra Kim

Jung Hyun Seo

Hyo Sook Joo

Sung Jong Kim

Heon Kook Kwon

Yoon Tae Hwang

Byung Su Kang

Jong Rok Jeon

Hyunsik Kim

Seung A Back

Yong Sung Goo

Youngwoon Kwon

The present disclosure relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, can implement a top-emitting organic electronic device, can be applied in an inkjet method and can provide a thin display having low dielectric constant characteristics.

Encapsulating composition

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can maintain reliability of a sealing structure under severe conditions such as high temperature and high humidity while providing a thin display, and an organic electronic device comprising the same.

A method for encapsulating an organic electronic element and an organic electronic device is provided. The method for encapsulating the organic electronic element is capable of effectively blocking moisture or oxygen introduced from the outside to an organic electronic device, is excellent in flatness of an encapsulating layer to have excellent endurance reliability, and increases efficiency of an encapsulating process.

Method for encapsulating organic electronic element

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, can implement a top-emitting organic electronic device, can be applied in an inkjet method, can provide a thin display and can effectively prevent interference of an electromagnetic field due to a low dielectric constant.

The present application provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside, and has excellent spreadability, is applicable to thin organic electronic devices and has excellent hardness of the cured product after curing, without causing an inter-circuit interference problem.

Provided is an encapsulating composition and an organic electronic device comprising the same. The encapsulating composition can effectively block moisture or oxygen from being introduced into an organic electronic device from the outside. The encapsulating composition can secure the lifetime of the organic electronic device, make it possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can provide a thin display.

The present application relates to a method for preparing an organic electronic device, and the organic electronic device prepared by the same, the method for preparing an organic electronic device can improve flatness and adhesion of an organic layer in a process of sealing an organic electronic element to effectively block moisture or oxygen from the outside, thereby securing the lifetime of the organic electronic device.

Method for preparing organic electronic device

Provided is a method for preparing an organic electronic device, comprising steps of: applying an ink composition on a substrate, on which an organic electronic element is formed; applying heat thereto before curing the applied ink composition; and curing the applied ink composition by irradiating with light having a wavelength in a range of 300 nm to 450 nm. Also provided is an organic electronic device, comprising a substrate, an organic electronic element formed on the substrate, and an organic layer sealing the entire surface of the organic electronic element, wherein after the organic layer is maintained at 110&#xb0; C. for 30 minutes, the out-gas amount measured using Purge & Trap-gas chromatography/mass spectrometry is less than 150 ppm.

The present invention relates to a method of bonding substrates and a substrate for displays manufactured by the same. In an embodiment, the method comprises (a) printing a first photocurable adhesive ink on the lower substrate to form a pattern; (b) photocuring the pattern to form a spacer on the lower substrate; (c) printing a second photocurable adhesive ink on the lower substrate, which includes the spacer, to form an adhesive layer; (d) irradiating the adhesive layer with light; and (e) laminating the upper substrate to the lower substrate via the adhesive layer, wherein the upper and lower substrates are transparent or opaque, and wherein the upper and lower substrates comprise the same or different materials.

Method for bonding substrate and substrate for display manufactured by the same

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can provide a thin display.

The present application relates to an ink composition comprising a glycidyl ether compound and a method for forming an organic layer using the same, and provides an ink composition capable of forming an organic layer and adjusting haze in a curing process for an intended use, and a method of forming an organic layer using the same.

Ink composition

The present application relates to an encapsulating composition, a method for preparing the same and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method, can provide a thin display and can control moisture content to prevent damage to the element.

Provided is an organic electronic device and a method for manufacturing the same. The organic electronic device can effectively block moisture or oxygen from being introduced from the outside into the organic electronic device. The organic electronic device can secure the lifetime of an organic electronic element and has excellent durability while being applicable to a flexible device.

Organic electronic device

The present application relates to an encapsulating composition, an organic electronic device, a method for evaluating reliability of the organic electronic device and a method for preparing the organic electronic device, and provides an encapsulating composition which can improve flatness and adhesion of an organic layer sealing an organic electronic element to effectively block moisture or oxygen introduced into an organic electronic device from the outside, thereby securing the lifetime of the organic electronic device.

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Daejeon, South Korea

Joon Hyung Kim