Samsung Electro-mechanics Co., Ltd.

Joon Hyung Cho

Jin Suk Son

Chang Jae Heo

Jin Su Kim

Tae Hyun Kim

In Wha Jeong

Bum Seok Suh

Jae Hyun Lim

Kee Ju Um

Jae Hoon Park

Eun Jung Jo

Young Hoon Kwak

Jong Man Kim

Kyu Hwan Oh

Job Ha

Chang Seob Hong

Si Joong Yang

Min Gyu Park

Disclosed herein is a semiconductor module package, including: a first module including a first heat radiation substrate and one or more first semiconductor elements and having a first N terminal and a first P terminal formed at one end thereof; a second module including a second heat radiation substrate and one or more second semiconductor elements, having a second N terminal and a second P terminal formed at one end thereof, and disposed so as to face the first module; and a first output terminal formed by electrically connecting the first module to the second module.

Semiconductor module package

Semiconductor device

Growing community of inventors

Suwon, South Korea

Joon Hyung Cho