Samsung Electro-Mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Joon Ho Yoon

Jung Ho Kim

Do Hoon Kim

Jung Dae Lee

Bu Youn Lee

Jae Hyoung Sim

Jong Youb Kim

Kyoung Rock Kim

Bum Jang

Yong Chil Choi

Je Myung Moon

Suk Su Bae

Chang Hoon Kwak

Yun Seup Chung

Chul Soo Yoon

Seon Goo Lee

Jong Rak Sohn

Yong Hyun Kil

Doo Hoon Ahn

Chulsoo Yoon

Sun Choi

Young Sam Park

Jung Park

Jun Sik Hwang

Jin Baek Kim

Woo Seog Song

Moon Sun Shin

Il Woo Park

Jae Joon Yoon

Yeon Seob Yun

Ok Hee Shin

Tae Duk Kim

Jin Woo Hong

Hong Min Kim

Jae Woo Cho

Dong Gi Han

Kwang Min Lee

Young Taek Kim

Chan Wang Park

Hae Gyun Shin

Hyoung Seo Choi

Min Gi Cho

Jae Youn Cho

Ki Pyo Ahn

Sun Muk Choi

An integrated air conditioner comprises: a housing partitioned into a first housing on the upper side thereof and a second housing on the lower side thereof, wherein the first housing has a first intake port through which external air is introduced thereinto and a first exhaust port through which internal air is exhausted therefrom, and the second housing has a second intake port through which external air is introduced thereinto and a second exhaust port through which internal air is exhausted therefrom; a compressor provided in the interior of the housing to compress a refrigerant; a condenser that is provided on a second fluid channel, which connects the second intake port and the second exhaust port, and condenses the compressed refrigerant, supplied from the compressor, into a liquid phase; an expansion unit that expands the refrigerant, condensed in the condenser, into a low-pressure refrigerant; and an evaporator.

Integrated air conditioner

Disclosed herein is an air conditioner. The air conditioner includes a housing having an inlet and an outlet, and having a first guide surface forming the outlet and a second guide surface facing the first guide surface provided therein, a heat exchanger configured to heat-exchange air suctioned through the inlet, a blower fan configured to suction air from the inlet, heat-exchange the air by passing air through the heat exchanger, and discharge air toward the outlet, and an airflow control unit provided to be movable between a first position adjacent to one end portion of the outlet from which air is discharged and a second position spaced apart from the end portion of the outlet from which air is discharged, and protruding from the first guide surface or the second guide surface when the airflow control unit placed at the first

Air conditioner

Disclosed herein is an air conditioner. The air conditioner includes a housing having an inlet and an outlet, and having a first guide surface forming the outlet and a second guide surface facing the first guide surface provided therein, a heat exchanger configured to heat-exchange air suctioned through the inlet, a blower fan configured to suction air from the inlet, heat-exchange the air by passing air through the heat exchanger, and discharge air toward the outlet, and an airflow control unit provided to be movable between a first position adjacent to one end portion of the outlet from which air is discharged and a second position spaced apart from the end portion of the outlet from which air is discharged, and protruding from the first guide surface or the second guide surface when the airflow control unit placed at the first position.

Disclosed herein is a air conditioner. The air conditioner a housing including a suction port and a discharge port, a heat exchanger provided inside the housing, a blower fan configured to suction air through the suction port, pass and heat-exchange the air through the heat exchanger, and then discharge the air through the discharge port, and a sub-flow path that suctions and guides some air around the discharge port using a suction force of the blower fan to control the flowing direction of the air discharged from the discharge port.

An indoor unit of an air conditioner having improved structures of suction, discharge and/or flow passages which may increase operation efficiency, reduce noises and realize a compact size. The indoor unit includes a housing comprising a front panel and a rear panel coupled to a rear portion of the front panel, at least one discharge outlet exposed to a front of the front panel, at least one suction inlet formed in the rear panel at a position corresponding to the discharge outlet, at least one heat exchanger disposed at a front portion of the suction inlet to absorb heat from air introduced through the suction inlet or transfer heat to the air introduced through the suction inlet, and at least one diagonal flow fan disposed between the heat exchanger and the discharge outlet to suction air passing through the heat exchanger and discharge the air through the discharge outlet.

Indoor unit of air conditioner and method of controlling the air conditioner

The invention provides a high quality composite phosphor powder which ensures diversity in emission spectrum, color reproduction index, color temperature and color, a light emitting device using the same and a method for manufacturing the composite phosphor powder. The composite phosphor powder comprises composite particles. Each of the composite particles includes at least two types of phosphor particles and a light transmitting binder. The phosphor particles have different emission spectrums. In addition, the light transmitting binder is formed between the phosphor particles and binds them together.

Composite phosphor powder, light emitting device using the same and method for manufacturing composite phoshpor powder

The present invention relates to phosphor blend for wavelength conversion and a white light emitting device using the same. The phosphor blend of the invention comprises three phosphors, A(PO)Cl:Eu, DSiO:Eu and MS:Eu at a composition where near ultraviolet radiation is converted into light positioned at a CIE coordinate (x, y), where 0.25&#x2266;x&#x2266;0.45 and 0.25&#x2266;y&#x2266;0.43, wherein A comprises at least one of Sr, Ca, Ba, and Mg, D comprises at least one of Ba, Sr, and Ca, and M comprises at least one of Sr and Ca. Furthermore, the present invention provides a new white light emitting device in combination of the phosphor blend and a near ultraviolet LED.

Phosphor blend for wavelength conversion and white light emitting device using the same

Composite phosphor powder, light emitting device using the same and method for manufacturing composite phosphor powder

Disclosed herein is a method for producing a molding compound resin tablet for wavelength conversion. The method comprises the steps of wet-dispersing a phosphor powder in a translucent liquid resin to form a molding compound resin body in which the phosphor powder is dispersed, and grinding the molding compound resin body into a powder form and applying a predetermined pressure to the resin powder. Further disclosed is a method for manufacturing a white light emitting diode using the molding compound resin tablet by a transfer molding process.

Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method

The present invention provides a phosphor blend for wavelength conversion and a white light emitting device using the phosphor blend. Further disclosed is a white light emitting phosphor blend comprising 0.5&#x2dc;18 wt % of A(PO)Cl:Eu(where A is at least one element selected from Sr, Ca, Ba and Mg), 0.7&#x2dc;14 wt of DSiO:Eu (where D is at least one element selected from Ba, Sr and Ca), and 68&#x2dc;98.5 wt % of GEu(WO):Sm (where G is at least one element selected from Li, Na and K; and s is a number between 1 and 5), based on the total weight of the phosphor blend.

Phosphor blends for wavelength conversion and white light emitting device using the same

Light-emitting diode

Disclosed are a chip scale package and a method of fabricating the chip scale package. The chip scale package comprises conductive layers with a designated depth formed on an upper and a lower surfaces of a chip, and electrode surfaces formed on the same side surfaces of the conductive layers, which are connected to corresponding connection pads of a printed circuit board. The chip scale package is miniaturized in the whole package size. Further, the method of fabricating the chip scale package does not require a wire-bonding step or a via hole forming step, thereby simplifying the fabrication process of the chip scale package and improving the reliability of the chip scale package.

Chip scale package and method of fabricating the same

Growing community of inventors

Seoul, South Korea

Joon Ho Yoon