Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Joon Dong Kim

Yeong Beom Ko

Jin Han Kim

Se Woong Cha

Ji Hun Lee

Dong Jin Kim

Hee Sung Kim

Dong Jean Kim

Sang Seon Oh

Jae Jin Lee

Dae Byoung Kang

Yeoung Beom Ko

A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Package-on-package type semiconductor package

Method of manufacturing a package-on-package type semiconductor package

An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.

Semiconductor device and method of manufacturing a semiconductor device

A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.

Semiconductor package and fabricating method thereof

Growing community of inventors

Gwangju, South Korea

Joon Dong Kim