Lg Electronics Inc.

Jookwon Kim

Kyungdo Kim

Minkyu Hwang

Hyunwoo Jun

Seokjae Jeong

Gyusang Lee

The present disclosure relates to a mold apparatus, and according to an aspect of the present disclosure, there is provided a mold apparatus including a cavity mold comprising a cavity mold plate formed with a cavity at a front surface thereof and provided with a heating means at an inner portion thereof, and a cooling plate brought into contact with or separated from a rear surface of the cavity mold plate and provided with a cooling means at an inner portion thereof; and a core mold configured to determine the cavity together with the cavity mold plate, wherein the cooling plate is formed with at least two or more divided surfaces.

Growing community of inventors

Changwon-si, South Korea

Jookwon Kim