Samsung Electronics Co., Ltd.

Joodong Kim

Sungjin Kim

Jung-Hoon Han

Junyong Noh

Seokhwan Kim

Seok-ho Shin

Jaepil Lee

Jaewon Seo

Dongwon Lim

Hyekyeong Kweon

Bonhwi Gu

A semiconductor device including a semiconductor substrate including a chip region and an edge region around the chip region; a lower dielectric layer and an upper dielectric layer on the semiconductor substrate; a redistribution chip pad that penetrates the upper dielectric layer on the chip region and is connected a chip pad; a process monitoring structure on the edge region; and dummy elements in the edge region and having an upper surface lower than an upper surface of the upper dielectric layer.

Semiconductor device

A semiconductor device includes a semiconductor substrate having a chip region and an edge region, a plurality of connection structures provided in a lower insulating layer of the edge region and arranged at first intervals in a first direction, an upper insulating layer covering the connection structures, and a plurality of redistribution pads disposed on the upper insulating layer and connected to the connection structures, respectively. Each of the redistribution pads includes a pad portion provided on the chip region. The pad portions of the redistribution pads are spaced apart from the connection structures by a first distance in a second direction intersecting the first direction when viewed in a plan view.

Growing community of inventors

Hwaseong-si, South Korea

Joodong Kim