Samsung Sdi Co., Inc.

Joo Young Chung

Jin Woo Choi

Min Gyum Kim

Jin Min Cheon

Ki Hyeok Kwon

Dong Hwan Lee

Seung Ryong Han

Eun Jung Lee

Yoon Man Lee

Woo Chul Na

So Yoon Kim

KyoungChul Bae

Ji Yoon Cho

The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.

Phosphonium-based compound, epoxy resin composition containing same, semiconductor device manufactured using same

A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1: 

Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the same

A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1: 

Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same

An epoxy resin composition and a semiconductor device, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a silicon compound, wherein the curing catalyst includes a phosphonium compound represented by the following Formula 4 and the silicon compound comprises a silicon compound represented by the following Formula 7: 

Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same

A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1: 

Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same

An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4: 

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Suwon-si, South Korea

Joo Young Chung