Samsung Electronics Co., Ltd.

Joo-Woo Kim

Chang-Hoon Lee

Byung-Am Lee

Chung-sam Jun

Dong-Jin Park

Kwang-Soo Kim

Sun-Yong Choi

Jeong-Hyun Choi

Byung-Seol Ahn

Jae-Sun Cho

Kyu-Hong Lim

Sung-Man Lee

An automated and integrated substrate inspecting apparatus for performing an EBR/EEW inspection, a defect inspection of patterns and reticle error inspection of a substrate includes a first stage for supporting a substrate; a first image acquisition unit for acquiring a first image of a peripheral portion of the substrate supported by the first stage; a second stage for supporting the substrate; a second image acquisition unit for acquiring a second image of the substrate supported by the second stage; a transfer robot for transferring the substrate between the first stage and the second stage; and a data processing unit, connected to the first image acquisition unit and the second image acquisition unit, for inspecting results of an edge bead removal process and an edge exposure process performed on the substrate using the first image, and for inspecting for defects of patterns formed on the substrate using the second image.

Apparatus and method for inspecting a substrate

In a method of aligning a wafer, which is capable of precisely and rapidly aligning the wafer, and a wafer alignment apparatus using the method of aligning the wafer, a first wafer is aligned to form a first template pattern corresponding to an image of the first wafer. Image data of a second wafer is inputted. A kind of the second wafer is different from that of the first wafer. A second template pattern is formed by transforming the first template pattern in response to the image data of the second wafer. The second wafer is then aligned in response to the second template pattern. Accordingly, the template pattern is formed using the image data to align the wafer although wafers having different images are inspected, thereby rapidly forming the template pattern.

Method for aligning a wafer and apparatus for performing the same

A wafer pattern inspecting apparatus and method are disclosed. The apparatus comprises an image sensor to acquire image data from a reference die and a sample die, an external memory to store the image data, an encoder to compress the data, a decoder to decompress the data, an internal memory device to store the compressed image data of the reference die, an arithmetic module to process the image data for the reference dies to extract a reference image data, a reference storage memory to store compressed reference image data, and a comparison module to compare the sample die image data with the reference image data to an extract defect data for the sample die.

Apparatus and method for inspecting patterns on wafers

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Seoul, South Korea

Joo-Woo Kim