Fairchild Korea Semiconductor Ltd.

Hynix Semiconductor Inc.

Joo-sang Lee

O-seob Jeon

Sung-Min Park

Gwi-gyeon Yang

Byoung-ok Lee

Young-gil Kim

Gi-young Jeun

Sung-won Lim

Jong-Hoon Park

Adams Zhu

Yong-suk Kwon

Frank Chen

A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.

Power device package

A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

Power module package having improved heat dissipating capability

A multi-bank semiconductor memory device includes a multi-bank memory; a voltage generator having one standby driving circuit and a plurality of active driving circuits and supplying a power source voltage required for a semiconductor device; and, an up/down counter for counting a low access signal and a low precharge signal and outputting a multi-bit driving enable signal for driving the plurality of active driving circuits differentially in performing an interleaving operation. When a plurality of banks are accessed, the number of banks being currently accessed is counted by using the low access signal and the low precharge signal. The number of the voltage driving circuits is increased and decreased according to the count value.

Apparatus and method for operation of multi-bank semiconductor memory device with an up/down counter

Growing community of inventors

Seoul, South Korea

Joo-sang Lee